EP2AGX260FF35C6NES

The EP2AGX260FF35C6NES is an Intel Arria II GX field-programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package. It combines high logic density, substantial on-chip memory, and a large user I/O count to address complex digital designs in commercial applications.

With 244,188 logic elements and approximately 12.04 Mbits of embedded memory, this device is suited for systems that require significant programmable logic and memory capacity within a compact surface-mount package.

Key Features

• High Logic Density — 244,188 logic elements provide extensive programmable logic resources for complex functions and parallel processing.
• Embedded Memory — Approximately 12.04 Mbits of on-chip RAM to support buffering, packet handling, and local data storage without external memory.
• Large I/O Count — 612 user I/O pins for broad system connectivity and interfacing with multiple peripherals or subsystems.
• Package and Mounting — 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for space-efficient board designs.
• Core Supply — Core voltage range of 870 mV to 930 mV, enabling predictable power planning for the FPGA core.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
• Regulatory Compliance — RoHS compliant for adherence to common environmental requirements.

Unique Advantages

• Significant programmable capacity: 244,188 logic elements give designers the headroom to integrate multiple subsystems and custom accelerators on a single device.
• On-chip memory reduces BOM: Approximately 12.04 Mbits of embedded RAM minimizes the need for external memory components for many buffering and storage tasks.
• High pin-count connectivity: 612 I/Os enable flexible routing of signals and support for numerous peripherals without complex board-level multiplexing.
• Compact, manufacturable package: 1152-BBGA FCBGA in a 35×35 footprint supports high-density PCBs and industry-standard surface-mount assembly.
• Clear power envelope: A defined core voltage range (870 mV–930 mV) aids in power-supply selection and thermal planning.
• Commercial readiness: 0 °C–85 °C rating and RoHS compliance align the device with common commercial product requirements.

Why Choose EP2AGX260FF35C6NES?

The EP2AGX260FF35C6NES positions itself as a high-capacity, commercially graded Arria II GX FPGA for designers who need substantial programmable logic and embedded memory in a compact FCBGA package. Its combination of 244,188 logic elements, roughly 12.04 Mbits of on-chip RAM, and 612 I/Os allows consolidation of complex digital functions while simplifying board-level design and connectivity.

This device is well suited to engineering teams seeking a commercial-grade FPGA with clear electrical and thermal parameters, RoHS compliance, and a surface-mount 1152-BBGA package for production-ready assemblies.

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