EP2AGX260FF35I3NAB

The EP2AGX260FF35I3NAB is an Intel Arria II GX field-programmable gate array (FPGA) in a 1152-ball FBGA package designed for industrial applications. It combines a high logic capacity with abundant I/O and on-chip memory to address bandwidth‑intensive and interface-rich designs.

Built on the Arria II architecture, this device is positioned for system-level integration where transceivers, memory interfaces and programmable logic must be combined with controlled power and extended temperature operation.

Key Features

• Logic Capacity — 244,188 logic elements to implement complex digital functions and system-level integration.
• Embedded Memory — Approximately 12.0 Mbits of on-chip RAM for FIFOs, buffering and local storage.
• I/O and Interfaces — 612 user I/O pins supporting a wide range of single-ended and differential interfaces for system connectivity.
• Transceiver and Protocol Support (device family) — Arria II family supports high-speed transceivers and common serial protocols, enabling integration of PCIe, Ethernet and other serial links (refer to device handbook for protocol specifics).
• Power Supply — Core voltage range from 870 mV to 930 mV for system power budgeting and regulation planning.
• Package and Mounting — 1152-ball FCBGA (35 × 35 mm) surface-mount package suitable for board-level implementation.
• Operating Range — Industrial-grade operation from −40°C to 100°C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑speed networking and switching — Use the device’s high logic density and family transceiver support to implement packet processing, MAC/PHY functions and interface bridging.
• Protocol and interface bridging — Integrate multiple serial and parallel interfaces (PCIe, Ethernet, serial protocols) into a single programmable device for system consolidation.
• Memory controller and buffering — Leverage approximately 12.0 Mbits of embedded RAM and abundant I/O for DDR3 interface logic and on‑chip buffering.
• Industrial control and communication — Industrial temperature rating and high I/O count make it suitable for embedded systems requiring robust interfacing and real-time logic.

Unique Advantages

• High integration density: 244,188 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 12.0 Mbits of embedded RAM supports local buffering, small FIFOs and state storage without external memory.
• Extensive I/O capability: 612 user I/O pins accommodate diverse peripherals and high‑pin-count interfaces, simplifying system routing and connectivity.
• Industrial‑grade operation: Rated for −40°C to 100°C operation to meet temperature demands of industrial deployments.
• Surface‑mount packaging: 1152-ball FCBGA package offers a compact footprint with high pin count for dense board designs.
• RoHS compliant: Environmentally compliant manufacturing for regulatory alignment.

Why Choose EP2AGX260FF35I3NAB?

The EP2AGX260FF35I3NAB delivers a balance of high logic capacity, significant embedded memory and extensive I/O in an industrial-grade FPGA package. It is suited to designers consolidating complex interface logic, high-bandwidth data paths and memory buffering into a single programmable device while maintaining thermal and power planning constraints.

This device is appropriate for engineering teams building networking, communications, and industrial control systems that require a robust, field-programmable solution with strong ecosystem support from the Arria II family documentation and development toolchain.

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