EP2AGX260FF35I3NGA

The EP2AGX260FF35I3NGA is an Arria II GX field programmable gate array (FPGA) from Intel, provided in a 1152‑FBGA (35×35 mm) surface‑mount package. It delivers substantial programmable logic capacity, embedded memory, and a high I/O count for dense, industrial‑grade digital designs.

With 244,188 logic elements, approximately 12.04 Mbits of embedded RAM, and 612 I/Os, this device is suited to applications that require high integration, extensive on‑chip resources, and operation across a wide industrial temperature range.

Key Features

• Logic Capacity  244,188 logic elements provide large programmable logic resources for complex custom digital designs.
• Embedded Memory  Approximately 12.04 Mbits of on‑chip RAM support buffering, local data storage, and memory‑intensive tasks without immediate reliance on external memory.
• I/O Density  612 general‑purpose I/Os enable extensive device interfacing and high pin‑count connectivity in system implementations.
• Industrial Grade  Rated for operation from −40 °C to 100 °C, suitable for deployments that require broad temperature tolerance.
• Power Supply Range  Operates with a core voltage supply between 870 mV and 930 mV, allowing integration within designs that target this voltage window.
• Package & Mounting  1152‑FBGA (35×35) FCBGA package in a surface‑mount form factor supports compact board layouts and high‑density placement.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances in manufacturing.

Typical Applications

• Custom Digital Logic  Compile and implement bespoke state machines, datapaths, and control logic leveraging the large logic capacity.
• Embedded Memory‑Centric Designs  Use the on‑chip RAM for buffering, lookup tables, and local storage to reduce external memory dependence.
• High‑Density I/O Systems  Integrate multiple sensors, peripherals, or bus interfaces using the device’s 612 I/Os for consolidated system I/O.

Unique Advantages

• High Integration: Large logic element count and substantial embedded RAM reduce the need for multiple discrete components, simplifying BOM and system design.
• Broad I/O Support: 612 I/Os enable flexible system interfacing and support for complex connectivity requirements on a single device.
• Industrial Temperature Range: Operation from −40 °C to 100 °C provides resilience in applications exposed to wide temperature swings.
• Compact, Surface‑Mount Package: The 1152‑FBGA (35×35) package allows for dense PCB integration while maintaining high pin count.
• Regulatory Compatibility: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose EP2AGX260FF35I3NGA?

The EP2AGX260FF35I3NGA combines substantial programmable logic resources, significant on‑chip memory, and a high I/O count in an industrial‑grade, surface‑mount FBGA package. These characteristics make it suitable for engineers and procurement teams looking for a highly integrated FPGA platform that supports complex digital designs and reliable operation across a wide temperature range.

Designed for systems that require large logic capacity and embedded RAM while maintaining dense connectivity and RoHS compliance, this Arria II GX device offers a balance of integration and robustness for long‑lifecycle industrial applications.

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