EP2AGX260FF35I3

The EP2AGX260FF35I3 is an Arria II GX field programmable gate array (FPGA) from Intel, offered in an industrial-grade surface-mount 1152‑FBGA (35×35) package. It provides a high-density programmable-logic resource with a documented device handbook covering electrical characteristics, transceiver performance, and I/O timing for system designers.

With a large logic capacity, substantial on-chip memory, and a high I/O count, this device targets applications that require dense logic integration and robust operation across an industrial operating temperature range.

Key Features

• High logic density — 244,188 logic elements to implement complex digital functions and large custom logic blocks.
• Embedded memory — Approximately 12 Mbits of on-chip RAM for buffering, LUTs, and data storage close to logic.
• Extensive I/O — 612 general-purpose I/O pins to support multi-channel interfaces and dense board connectivity.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Core supply range — Core voltage supply specified from 870 mV to 930 mV for power planning and regulator selection.
• Package and mounting — 1152‑BBGA/FCBGA package topology, supplied as a surface-mount device (1152‑FBGA, 35×35 footprint) for high-density PCB integration.
• Standards and compliance — RoHS compliant to meet environmental procurement requirements.
• Documented device behavior — Device handbook content details electrical characteristics, transceiver performance specifications, and I/O timing to aid system-level design and validation.

Typical Applications

• Industrial control — Implement complex control logic and multiple I/O interfaces while operating over an industrial temperature range.
• High-density FPGA designs — Use the large logic element count and embedded memory for feature-rich, compact FPGA-based systems.
• Interface aggregation — Support many parallel or multiplexed interfaces with 612 I/O pins for communications and system integration tasks.

Unique Advantages

• High integration density: 244,188 logic elements reduce the need for multiple devices and simplify board-level designs.
• Substantial on-chip memory: Approximately 12 Mbits of RAM enable local data storage and lower external memory dependency.
• Large I/O complement: 612 I/Os provide flexibility for multi-protocol interfacing and high pin-count applications.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact FCBGA package: 1152‑FBGA (35×35) supports high-density PCB layouts while remaining surface-mount compatible.
• Regulatory compliance: RoHS compliance helps meet environmental and procurement standards.

Why Choose EP2AGX260FF35I3?

The EP2AGX260FF35I3 delivers a balance of high logic capacity, embedded memory, and abundant I/O in an industrial-grade FPGA package. Its documented electrical and transceiver characteristics help engineers evaluate system behavior and integrate the device into complex designs.

This part is well suited to development teams and OEMs building high-density, industrial applications that require substantial programmable logic, on-chip RAM, and a wide I/O complement within a compact surface-mount FCBGA footprint.

Request a quote or submit a procurement inquiry today to evaluate EP2AGX260FF35I3 for your next design project.