EP2AGX260FF35I3N

The EP2AGX260FF35I3N is an Arria II GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA/FBGA package. It delivers 244,188 logic elements, approximately 12 Mbits of embedded memory, and 612 I/O pins for dense, programmable digital implementations.

Built and rated for industrial use, the device supports an operating temperature range of −40 °C to 100 °C and a core supply range of 870 mV to 930 mV, making it suitable for designs that require high logic capacity, substantial on-chip memory, and high I/O density.

Key Features

• Logic Capacity — 244,188 logic elements to implement complex digital functions and large custom logic blocks.
• Embedded Memory — Approximately 12 Mbits of on-chip RAM for buffering, data tables, and intermediate storage.
• I/O Density — 612 general-purpose I/Os to support extensive external interfacing and parallel connectivity.
• Package — 1152-ball BGA package in an FCBGA/FBGA format with a 35×35 footprint for high pin count in a surface-mount form factor.
• Power — Core voltage supply range of 870 mV to 930 mV for defined power budgeting and regulator selection.
• Thermal and Grade — Industrial-grade device rated for −40 °C to 100 °C operation.
• Mounting & Compliance — Surface-mount device; RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing — Implement wide datapaths, custom accelerators, and complex state machines using large on-chip logic and memory resources.
• System I/O aggregation — Consolidate multiple interfaces and sensors with the high 612-pin I/O count to simplify board-level integration.
• Industrial control and automation — Deploy in temperature-challenging environments thanks to the industrial operating range and surface-mount BGA package.

Unique Advantages

• High integration of logic and memory: 244,188 logic elements combined with ~12 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive external interfacing: 612 I/Os enable broad connectivity options for peripherals, sensors, and parallel interfaces without additional I/O expanders.
• Industrial temperature rating: Qualified for −40 °C to 100 °C operation to meet rugged deployment requirements.
• Compact, high-pin-count packaging: 1152-ball FCBGA/FBGA (35×35) surface-mount package delivers many I/Os in a board-efficient footprint.
• Controlled core voltage window: 870–930 mV supply range supports precise power design and regulator selection.
• RoHS compliant: Meets standard environmental compliance for modern manufacturing processes.

Why Choose EP2AGX260FF35I3N?

The EP2AGX260FF35I3N positions itself as a high-capacity, industrial-grade FPGA choice for designs that require a combination of large programmable logic, substantial on-chip memory, and a high number of I/Os in a compact surface-mount package. Its defined core voltage window and wide operating temperature range support robust power and thermal planning for production deployments.

This device is suited to engineering teams building complex, interface-rich systems where integrating logic and memory on-chip reduces bill of materials and simplifies board design while maintaining industrial operating margins.

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