EP2AGX260FF35I5N

The EP2AGX260FF35I5N is an Arria II GX FPGA supplied in a 1152-BBGA (FCBGA) surface-mount package and specified as industrial grade. It provides a combination of high logic capacity, on-chip memory, and dense I/O for designs that require substantial programmable logic and flexible interfacing.

Key device characteristics include 244,188 logic elements, approximately 12.04 Mbits of embedded memory, and 612 I/O pins, enabling integration of complex digital, interface, and protocol functions in a single FPGA package.

Key Features

• Core Logic Capacity  244,188 logic elements (logic cells) for implementing large-scale programmable logic and custom datapaths.
• Embedded Memory  Approximately 12.04 Mbits of on-chip RAM (12,038,144 bits) to support buffering, FIFOs, and on-chip data storage.
• I/O Density  612 I/O pins to support high pin-count interfaces and multiple parallel or serial connections.
• Programmable I/O and Timing  Device documentation covers I/O timing controls including programmable I/O element (IOE) delay and programmable output buffer delay for precise interface tuning.
• Transceiver and PCIe Support (Documented)  Datasheet content references transceiver specifications and a PCI Express (PIPE) HIP block, as part of the device’s electrical and switching characteristics.
• Power  Core supply voltage range documented at 0.870 V to 0.930 V to guide power-supply design and budgeting.
• Package and Mounting  1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) with surface-mount mounting for compact, high-density board designs.
• Temperature Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory  RoHS compliant.

Typical Applications

• PCI Express and High-speed Serial Interfaces  Device documentation includes transceiver and PCI Express (PIPE) HIP block references, making the device suitable where documented transceiver and PCIe building blocks are required.
• Custom I/O and Protocol Bridging  High I/O count and programmable I/O timing support complex interface logic, protocol conversion, and board-level bridging tasks.
• Compute- and Memory-intensive Logic  Large logic element count and approximately 12.04 Mbits of embedded memory enable implementation of significant on-chip processing, buffering, and custom data flows.

Unique Advantages

• High Logic Density: 244,188 logic elements provide capacity for large designs and complex state machines without resorting to multiple devices.
• Substantial On-chip Memory: Approximately 12.04 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage needs.
• Extensive I/O Capacity: 612 I/Os permit flexible partitioning between high-speed interfaces and parallel peripheral connections.
• Configured I/O Timing: Programmable IOE and output buffer delays documented in the device handbook allow precise timing adjustment for interfacing varied peripherals.
• Designed for Industrial Use: Specified −40 °C to 100 °C operating range supports deployment in industrial temperature environments.
• Compact, High-density Package: 1152-BBGA (35×35 supplier package) enables high-pin-count capability in a compact footprint.

Why Choose EP2AGX260FF35I5N?

The EP2AGX260FF35I5N delivers a balanced combination of high logic element count, significant embedded memory, and large I/O capacity within a compact 1152-BBGA package. Its documented programmable I/O timing and transceiver/PCIe references in the device handbook make it a fit for engineered solutions that require detailed electrical and switching characterization.

This part is appropriate for development teams and systems integrators who need a single FPGA solution capable of consolidating complex logic, buffering, and multi-interface connectivity while meeting industrial temperature requirements and RoHS compliance.

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