EP2AGX45CU17C4G

The EP2AGX45CU17C4G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 358-LFBGA FCBGA package. It provides a balanced combination of programmable logic capacity, on-chip memory, and I/O resources for board-level digital designs.

Key device attributes include 42,959 logic elements, approximately 3.517 Mbits of embedded memory, 156 I/Os, surface-mount packaging in a 17 × 17 FCBGA, operation from 870 mV to 930 mV supply, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 42,959 logic elements and 1,805 LABs provide substantial programmable resource for custom digital implementations.
• On-Chip Memory Approximately 3.517 Mbits of embedded RAM to support buffering, state storage, and local data processing without external memory.
• I/O Count 156 general-purpose I/Os for interfacing to peripherals, sensors, and other board-level components.
• Power Supply Designed to operate from a 870 mV to 930 mV supply range, enabling integration with low-voltage systems.
• Package & Mounting Available in a 358-LFBGA (358-UBGA, FCBGA 17×17) surface-mount package for compact board-level integration.
• Temperature & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Custom digital logic Implement application-specific processing and control functions using the device’s 42,959 logic elements and 1,805 LABs.
• Memory‑assisted processing Leverage approximately 3.517 Mbits of on-chip RAM for local buffering, state machines, and data manipulation without immediate external memory.
• High-density I/O interfacing Use 156 I/Os to connect multiple peripherals, sensors, and communication endpoints on a single board.
• Compact board designs Surface-mount 358-LFBGA FCBGA package (17 × 17) enables dense PCB layouts where board area is constrained.

Unique Advantages

• Substantial programmable resources: 42,959 logic elements and 1,805 LABs give designers the headroom to implement complex logic and control functions on-chip.
• Significant embedded memory: Approximately 3.517 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Flexible connectivity: 156 I/Os simplify integration with a wide range of peripherals and interfaces at the board level.
• Compact surface-mount package: 358-LFBGA / 358-UBGA FCBGA (17 × 17) supports dense PCB integration while maintaining robust solder mounting.
• Low-voltage operation: Narrow supply range of 870 mV to 930 mV suits low-voltage system architectures.
• Commercial availability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose EP2AGX45CU17C4G?

The EP2AGX45CU17C4G delivers a practical balance of logic capacity, embedded memory, and I/O density in a compact FCBGA package, making it suitable for board-level designs that require substantial on-chip resources without external memory dependence. Its defined supply range and commercial temperature rating simplify integration into low-voltage, room-temperature systems.

Backed by Intel’s Arria II GX FPGA family documentation, this device is appropriate for design teams seeking a known FPGA form factor with clear resource allocations for planning and implementation.

Request a quote or submit an inquiry for pricing and availability of EP2AGX45CU17C4G to evaluate it for your next design project.