EP2AGX45CU17C5G

IC FPGA 156 I/O 358UBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 156 3517440 42959 358-LFBGA, FCBGA

Quantity 1,144 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package358-UBGA, FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case358-LFBGA, FCBGANumber of I/O156Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1805Number of Logic Elements/Cells42959
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits3517440

Overview of EP2AGX45CU17C5G – Arria II GX FPGA, 156 I/O, 358-LFBGA

The EP2AGX45CU17C5G is an Intel Arria II GX field-programmable gate array supplied in a 358-lead LFBGA (FCBGA) package. It delivers 42,959 logic elements and approximately 3.52 Mbits of embedded memory, making it suitable for commercial-grade digital designs that require significant on-chip logic and memory integration.

Designed for surface-mount assembly, this device supports 156 I/O pins and operates from a core voltage range of 870 mV to 930 mV with an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity 42,959 logic elements provide substantial on-chip programmable logic resources for complex digital functions.
  • Embedded Memory Approximately 3.52 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic functions.
  • I/O and Packaging 156 I/O pins in a 358-LFBGA (FCBGA) package; supplier device package listed as 358-UBGA (17×17). Surface-mount mounting type supports standard PCB assembly flows.
  • Power Core supply voltage range of 870 mV to 930 mV to match platform power architectures that use low-voltage FPGA cores.
  • Operating Range Commercial-grade operation from 0 °C to 85 °C for standard commercial applications.
  • Environmental Compliance RoHS compliant for lead-free manufacturing and reduced environmental impact.

Unique Advantages

  • High logic density: 42,959 logic elements enable implementation of complex state machines, datapaths, and custom logic without external glue logic.
  • Integrated memory resources: Approximately 3.52 Mbits of embedded RAM reduce the need for external memory for many buffering and lookup applications.
  • Generous I/O count: 156 I/O pins allow flexible interfacing to peripherals, sensors, and high-pin-count connectors within a single device.
  • Compact, manufacturable package: 358-LFBGA (17×17) surface-mount package supports automated assembly and dense PCB designs.
  • Low-voltage core compatibility: 870–930 mV core voltage aligns with modern low-voltage power budgets and voltage-rail planning.
  • Commercial-grade suitability: 0 °C to 85 °C operating range for standard commercial applications and environments.

Why Choose EP2AGX45CU17C5G?

The EP2AGX45CU17C5G combines a high count of logic elements, multi-megabit on-chip memory, and a broad I/O complement in a compact 358-LFBGA package. These characteristics make it well suited to commercial designs that require integrated programmable logic, embedded memory, and flexible I/O in a single FPGA device.

This device is appropriate for engineering teams designing commercial electronic systems who need a balance of logic capacity, local memory, and a manufacturable package. Its RoHS compliance and standard operating temperature range support typical commercial production and deployment scenarios.

Request a quote or submit an inquiry to check current availability and pricing for the EP2AGX45CU17C5G.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up