EP2AGX45CU17C5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 156 3517440 42959 358-LFBGA, FCBGA |
|---|---|
| Quantity | 1,144 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 358-UBGA, FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 358-LFBGA, FCBGA | Number of I/O | 156 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1805 | Number of Logic Elements/Cells | 42959 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 3517440 |
Overview of EP2AGX45CU17C5G – Arria II GX FPGA, 156 I/O, 358-LFBGA
The EP2AGX45CU17C5G is an Intel Arria II GX field-programmable gate array supplied in a 358-lead LFBGA (FCBGA) package. It delivers 42,959 logic elements and approximately 3.52 Mbits of embedded memory, making it suitable for commercial-grade digital designs that require significant on-chip logic and memory integration.
Designed for surface-mount assembly, this device supports 156 I/O pins and operates from a core voltage range of 870 mV to 930 mV with an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 42,959 logic elements provide substantial on-chip programmable logic resources for complex digital functions.
- Embedded Memory Approximately 3.52 Mbits of on-chip RAM to support buffering, state storage, and memory-mapped logic functions.
- I/O and Packaging 156 I/O pins in a 358-LFBGA (FCBGA) package; supplier device package listed as 358-UBGA (17×17). Surface-mount mounting type supports standard PCB assembly flows.
- Power Core supply voltage range of 870 mV to 930 mV to match platform power architectures that use low-voltage FPGA cores.
- Operating Range Commercial-grade operation from 0 °C to 85 °C for standard commercial applications.
- Environmental Compliance RoHS compliant for lead-free manufacturing and reduced environmental impact.
Unique Advantages
- High logic density: 42,959 logic elements enable implementation of complex state machines, datapaths, and custom logic without external glue logic.
- Integrated memory resources: Approximately 3.52 Mbits of embedded RAM reduce the need for external memory for many buffering and lookup applications.
- Generous I/O count: 156 I/O pins allow flexible interfacing to peripherals, sensors, and high-pin-count connectors within a single device.
- Compact, manufacturable package: 358-LFBGA (17×17) surface-mount package supports automated assembly and dense PCB designs.
- Low-voltage core compatibility: 870–930 mV core voltage aligns with modern low-voltage power budgets and voltage-rail planning.
- Commercial-grade suitability: 0 °C to 85 °C operating range for standard commercial applications and environments.
Why Choose EP2AGX45CU17C5G?
The EP2AGX45CU17C5G combines a high count of logic elements, multi-megabit on-chip memory, and a broad I/O complement in a compact 358-LFBGA package. These characteristics make it well suited to commercial designs that require integrated programmable logic, embedded memory, and flexible I/O in a single FPGA device.
This device is appropriate for engineering teams designing commercial electronic systems who need a balance of logic capacity, local memory, and a manufacturable package. Its RoHS compliance and standard operating temperature range support typical commercial production and deployment scenarios.
Request a quote or submit an inquiry to check current availability and pricing for the EP2AGX45CU17C5G.

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