EP2AGX45CU17C6

The EP2AGX45CU17C6 is a commercial-grade Arria II GX field programmable gate array (FPGA) in a 358-LFBGA/FCBGA package. It delivers a balanced combination of programmable logic, embedded memory, and I/O resources for mid-to-high density designs.

Designed for applications requiring significant on-chip logic and RAM alongside a substantial I/O count, this device operates from a core supply range of 870 mV to 930 mV and supports an ambient operating range of 0 °C to 85 °C.

Key Features

• Core logic — 42,959 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded memory — approximately 3.52 Mbits of on-chip RAM for buffering, FIFOs, and state storage within the FPGA fabric.
• I/O capacity — 156 user I/O pins to support multi-channel interfaces and peripheral connectivity.
• Power supply — core voltage supply range from 870 mV to 930 mV for core power planning and regulator selection.
• Package & mounting — 358-LFBGA (supplier package: 358-UBGA, FCBGA, 17×17) in a surface-mount form factor.
• Operating range & grade — commercial grade with specified operating temperature from 0 °C to 85 °C.
• Standards compliance — RoHS compliant.

Typical Applications

• Complex logic implementations — Designs that require tens of thousands of logic elements for custom datapath, control, or protocol processing.
• Memory-backed functions — Applications that need several megabits of embedded RAM for buffering, packet queues, or temporary storage.
• I/O-rich systems — Systems requiring a high count of general-purpose I/Os for multi-channel interfacing and board-level connectivity.

Unique Advantages

• High programmable capacity: 42,959 logic elements provide the headroom to implement sizable custom logic blocks and state machines on-chip.
• On-chip memory resources: Approximately 3.52 Mbits of embedded RAM reduce external memory dependence and simplify board-level designs.
• Substantial I/O resources: 156 I/O pins streamline integration with multiple peripherals and parallel interfaces without excessive routing constraints.
• Compact surface-mount package: 358-LFBGA / 17×17 FCBGA packaging delivers high density in a board-friendly footprint.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range suited for mainstream electronics and industrial-adjacent applications that require commercial-grade devices.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and product deployment.

Why Choose EP2AGX45CU17C6?

The EP2AGX45CU17C6 combines a substantial logic element count, multi-megabit embedded RAM, and a high I/O complement in a compact surface-mount FCBGA package. Its Arria II GX architecture and defined electrical characteristics—such as the 870 mV–930 mV core supply range and commercial temperature rating—make it suitable for designers focused on consolidating logic, memory, and I/O on a single FPGA to simplify BOM and board routing.

This device is well suited to teams developing mid-to-high density programmable solutions that require predictable electrical requirements, RoHS compliance, and a package optimized for surface-mount assembly.

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