EP2AGX45CU17I3

The EP2AGX45CU17I3 is an Arria II GX Field Programmable Gate Array (FPGA) provided in a 358‑LFBGA FCBGA (17×17) package for surface-mount assembly. It delivers a high-capacity programmable logic fabric with on-chip memory and a substantial number of I/O pins for integration into complex digital designs.

With 42,959 logic elements, approximately 3.5 Mbits of embedded memory and 156 I/O, this FPGA is positioned for applications that require dense logic resources, embedded RAM, and reliable operation across an industrial temperature range.

Key Features

• Logic Capacity  42,959 logic elements provide a large programmable fabric for implementing custom digital functions and complex state machines.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM suitable for buffering, packet storage, and local data processing.
• I/O Density  156 I/O pins support broad connectivity options for external peripherals, buses, and interfaces.
• Power Supply  Operates from a core voltage range of 870 mV to 930 mV, enabling defined supply design around the FPGA core.
• Package and Mounting  358‑LFBGA (358‑UBGA, FCBGA 17×17) surface‑mount package for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and listed as Industrial grade for deployment in temperature‑challenging environments.
• RoHS Compliant  Meets RoHS requirements for material compliance.

Typical Applications

• Custom Digital Logic  Implement user-defined logic blocks and state machines where flexible, reprogrammable hardware is required.
• Memory‑Intensive Functions  Use the approximately 3.5 Mbits of on-chip RAM for buffering, local caching, and intermediate data storage.
• I/O‑Rich Interface Handling  Support multiple peripheral and bus connections using the 156 available I/O pins for interface bridging and glue logic.
• Industrial Systems  Deploy in industrial electronic systems that depend on components rated for −40 °C to 100 °C operation.

Unique Advantages

• High Logic Density: 42,959 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Approximately 3.5 Mbits of embedded RAM reduces dependence on external memory for many intermediate data tasks.
• Generous I/O Count: 156 I/O pins enable broad external connectivity without immediate need for additional I/O expanders.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in temperature‑variable environments.
• Compact Surface‑Mount Packaging: 358‑LFBGA FCBGA package (17×17) supports dense PCB layouts and automated assembly processes.
• Regulatory Compliance: RoHS compliance simplifies environmental and materials considerations in product design.

Why Choose EP2AGX45CU17I3?

The EP2AGX45CU17I3 combines a high count of logic elements, meaningful embedded memory, and a substantial number of I/Os in a compact FCBGA package rated for industrial temperatures. These concrete hardware attributes make it suitable for designs that need on‑device capacity for logic and memory while maintaining robust operation across a wide temperature range.

This FPGA is a fit for engineering teams and procurement looking for a programmable silicon option that balances logic density, on‑chip RAM, and I/O connectivity while meeting RoHS and industrial temperature requirements.

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