EP2AGX45CU17I5G

The EP2AGX45CU17I5G is an Intel Arria II GX field programmable gate array (FPGA) IC in a 358-LFBGA FCBGA package. It delivers a fabric with 42,959 logic elements and approximately 3.5 Mbits of embedded memory, making it suitable for logic- and memory-intensive programmable designs.

Designed for industrial-grade applications, this device provides 156 user I/O pins, a wide operating temperature range from −40 °C to 100 °C, and a supply voltage window of 870 mV to 930 mV to support deployment in temperature- and environment-sensitive systems.

Key Features

• FPGA Core 42,959 logic elements for implementing complex, customizable digital logic and control functions.
• Embedded Memory Approximately 3.5 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions without external memory.
• I/O Density 156 general-purpose I/O pins to interface with sensors, peripherals, and external logic.
• Power Operates within a supply voltage range of 870 mV to 930 mV, allowing designers to plan power delivery and sequencing precisely.
• Package 358-LFBGA FCBGA (17×17) package for high-pin-count, compact board integration.
• Temperature & Grade Industrial grade device rated for −40 °C to 100 °C operating temperature, supporting use in extended-temperature environments.
• Regulatory RoHS compliant, meeting common environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control Implement custom logic for motor control, PLC interfaces, and deterministic control tasks that require robust operation across −40 °C to 100 °C.
• Communications & Networking Provide programmable packet processing, protocol bridging, or control-plane logic where ample logic elements and embedded RAM are needed.
• Embedded Processing Serve as a customizable co-processor or glue logic in systems that require moderate on-chip memory and flexible I/O counts.

Unique Advantages

• Substantial Logic Capacity: 42,959 logic elements enable implementation of complex finite-state machines, datapaths, and custom accelerators without immediate migration to larger devices.
• Significant On-Chip Memory: Approximately 3.5 Mbits of embedded RAM reduces dependence on external memory for many buffer and storage needs, simplifying board design.
• Robust Temperature Performance: Industrial-grade operating range (−40 °C to 100 °C) supports deployment in harsh or temperature-variable environments.
• High I/O Count: 156 I/O pins provide flexibility for interfacing with a wide set of peripherals and external subsystems on dense PCBs.
• Compact, High-Pin Package: 358-LFBGA FCBGA (17×17) footprint helps conserve board area while accommodating many signals and power planes.
• RoHS Compliance: Conforms to lead-free manufacturing requirements for broad assembly compatibility.

Why Choose EP2AGX45CU17I5G?

The EP2AGX45CU17I5G positions itself as a flexible, industrial-grade FPGA option for designers who need a balanced combination of logic density, embedded memory, and I/O capability in a compact BGA package. Its specified supply voltage range and extended operating temperature make it suitable for systems with strict power and environmental requirements.

This device is well suited to engineers building mid-to-high complexity programmable logic solutions where on-chip resources and robust environmental performance translate to lower system BOM, simplified board design, and predictable behavior across operating conditions.

If you would like pricing, availability, or to request a quote for EP2AGX45CU17I5G, please submit a quote request or contact sales through your usual procurement channel.