EP2AGX45DF25C4

The EP2AGX45DF25C4 is an Arria II GX field programmable gate array (FPGA) offered in a 572‑ball FCBGA package. This commercial‑grade device provides a substantial logic resource and on‑chip memory for mid‑to‑high complexity digital designs that require flexible hardware programmability.

Key on‑device resources include 42,959 logic elements, approximately 3.52 Mbits of embedded RAM, and 252 user I/O pins, packaged in a 572‑FBGA (25 × 25 mm) surface‑mount form factor. The device operates from a core supply between 870 mV and 930 mV and is specified for operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic Capacity  42,959 logic elements provide a large, programmable fabric for implementing combinational and sequential logic functions at board level.
• Embedded Memory  Approximately 3.52 Mbits of on‑chip RAM to support buffering, FIFOs, and state storage without external memory in many use cases.
• I/O Count & Package  252 user I/Os in a 572‑FBGA package (25 × 25 mm) provide broad signal routing capability and dense board integration in a surface‑mount footprint.
• Power Supply  Core supply specified from 870 mV to 930 mV, enabling predictable power planning and voltage rail design for the FPGA core.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Mounting & Package Details  Surface‑mount 572‑ball FCBGA (572‑FBGA, FC) package for high‑density PCB assembly.
• Standards Compliance  RoHS compliant to support environmentally conscious assembly and manufacturing flows.

Unique Advantages

• Substantial Logic Resource: 42,959 logic elements enable consolidation of multiple functions into a single device, reducing component count on the PCB.
• Embedded Memory On‑Board: Approximately 3.52 Mbits of embedded RAM minimizes dependence on external memory for many buffering and state storage needs.
• Dense I/O in Compact Package: 252 I/Os in a 572‑FBGA (25 × 25 mm) package delivers high signal density while preserving a compact board footprint.
• Predictable Power Envelope: Defined core supply range (870 mV–930 mV) simplifies power rail design and allows accurate thermal and power budgeting.
• Commercial‑Grade Reliability: Specified 0 °C to 85 °C operating range suits a wide range of commercial applications and environments.
• RoHS Compliant: Supports lead‑free manufacturing and regulatory requirements for many global markets.

Why Choose EP2AGX45DF25C4?

The EP2AGX45DF25C4 Arria II GX FPGA combines a large logic fabric, significant embedded memory, and a high I/O count in a compact 572‑FBGA package—making it suitable for designs that require flexible hardware programmability and dense I/O routing. Its commercial temperature rating, defined core voltage range, and RoHS compliance provide practical predictability for production planning and compliance.

This device is well suited for development teams and procurement looking for a mid‑to‑high capacity FPGA offering explicit, verifiable resources (logic elements, on‑chip RAM, I/O count, package) and clear operating specifications for integration into commercial systems.

Request a quote or submit your requirements to get pricing and availability information for EP2AGX45DF25C4. Our team can provide lead‑time details, packaging information, and support documentation to help you move from evaluation to production.