EP2AGX45DF25C5

The EP2AGX45DF25C5 is an Arria II GX field-programmable gate array (FPGA) from Intel, packaged in a 572-ball FCBGA (25×25) surface-mount package. It provides a mid-to-high density programmable logic fabric with a large number of logic elements, on-chip embedded memory, and a substantial I/O count for complex, integration-focused designs.

Rated for commercial-grade operation, this device is suitable for applications requiring programmable logic, significant embedded RAM capacity, and flexible I/O connectivity within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity – 42,959 logic elements, enabling complex logic implementations and custom digital functions.
• Embedded Memory – Approximately 3.5 Mbits of on-chip RAM (3,517,440 bits) for buffering, FIFOs, and local data storage.
• I/O Resources – 252 user I/Os to support multiple parallel interfaces and board-level connectivity.
• Package & Mounting – 572-ball FCBGA (572-BGA) in a 25×25 mm supplier package; surface-mount mounting for standard PCB assembly.
• Power Supply Range – Core supply specified from 870 mV to 930 mV, compatible with typical FPGA core voltage rails.
• Commercial Grade – Operating temperature range of 0 °C to 85 °C and RoHS compliant.
• Arria II GX Family – Part of the Arria II device family, with device-level electrical and switching characteristics documented in the Arria II device handbook.

Typical Applications

• High-speed serial and protocol interfaces – Use the Arria II GX device family features (transceiver and PCIe blocks referenced in documentation) for designs that require serial link and protocol handling.
• Custom logic and prototyping – Implement application-specific datapaths, control logic, and hardware acceleration using the available logic elements and embedded RAM.
• Multi‑interface system integration – Leverage 252 I/Os to connect sensors, memory interfaces, and peripheral subsystems on a single FPGA.

Unique Advantages

• High logic density: 42,959 logic elements provide room for complex state machines, datapaths, and control logic without immediate migration to larger devices.
• Substantial embedded memory: Approximately 3.5 Mbits of on-chip RAM reduces external memory dependency for buffering and temporary storage.
• Generous I/O count: 252 I/Os enable broad peripheral and bus connectivity, simplifying board-level design and integration.
• Compact BGA footprint: 572-ball FCBGA (25×25) offers a dense package that helps conserve PCB area while maintaining high pin count.
• Commercial-grade qualification: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product requirements.
• Surface-mount compatibility: Standard surface-mount package allows integration into common manufacturing and assembly workflows.

Why Choose EP2AGX45DF25C5?

The EP2AGX45DF25C5 positions itself as a capable Arria II GX FPGA option where a balance of logic density, embedded memory, and I/O connectivity is required within a compact 572-FBGA package. Its commercial-grade rating and defined core voltage range make it suitable for production designs targeting standard temperature environments.

Designers seeking to consolidate functionality, implement custom hardware acceleration, or integrate multiple interfaces onto a single programmable device will find the EP2AGX45DF25C5 a practical choice for medium-to-high complexity designs backed by Intel's Arria II family documentation.

Request a quote today to check current availability and pricing for EP2AGX45DF25C5 and to confirm compatibility with your design requirements.