EP2AGX45DF25C5N

The EP2AGX45DF25C5N is an Arria II GX field programmable gate array (FPGA) offered in a commercial-grade device package. It provides a high density of programmable logic and on-chip RAM in a surface-mount 572-FBGA (25×25) package targeted at commercial electronic designs.

Key electrical and operating parameters include a core voltage supply range of 0.87 V to 0.93 V and a commercial operating temperature range of 0°C to 85°C. The device is RoHS compliant.

Key Features

• Logic Capacity — 42,959 logic elements to implement complex programmable logic and state machines.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O — 252 dedicated I/O pins to support high pin-count board-level interfacing.
• Package & Mounting — 572-FBGA (25×25) surface-mount package for compact, high-density PCB integration.
• Power — Core supply voltage specified from 870 mV to 930 mV to match system power rails and design constraints.
• Thermal/Grade — Commercial grade operation across 0°C to 85°C for standard commercial environments.
• Standards Compliance — RoHS compliant, supporting regulatory requirements for lead-free product designs.
• Device Family Documentation — As part of the Arria II GX family, comprehensive device-level electrical characteristics and I/O/transceiver performance specifications are available in the device handbook.

Typical Applications

• Commercial Embedded Systems — Programmable logic and embedded memory for control, data-path processing, and system glue logic in commercial products.
• High-density I/O Designs — Use the 252 I/O pins for board-level interfaces, peripheral aggregation, and custom signaling in compact layouts.
• Compact, High-pin-count PCB Integration — The 572-FBGA (25×25) surface-mount package enables dense routing and small form-factor assemblies within commercial temperature ranges.

Unique Advantages

• Substantial programmable resources: 42,959 logic elements provide the capacity to implement sizeable custom logic without external ASICs or CPLDs.
• On-chip memory for data handling: Approximately 3.5 Mbits of embedded RAM reduce external memory requirements for buffering and temporary storage.
• High I/O count: 252 I/O pins simplify integration with multiple peripherals and board subsystems, reducing the need for external multiplexing.
• Industry-standard package: 572-FBGA (25×25) surface-mount package supports high-density PCB designs and established assembly processes.
• Commercial environmental suitability: Rated for 0°C to 85°C operation and RoHS compliant to meet typical commercial regulatory needs.
• Documented device family specifications: Arria II GX device handbook coverage includes electrical and switching characteristics to support design and validation.

Why Choose EP2AGX45DF25C5N?

The EP2AGX45DF25C5N combines a large logic resource pool and multi-megabit embedded RAM in a compact 572-FBGA surface-mount package, making it a practical choice for commercial designs requiring significant on-chip logic and memory. Its 252 I/O pins and documented Arria II GX device characteristics help simplify board-level integration and system validation within standard commercial temperature ranges.

This part is well suited to design teams looking for a commercially graded FPGA solution with substantial capacity, a compact high-pin-count package, and RoHS compliance.

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