EP2AGX45DF25C6N

The EP2AGX45DF25C6N is an Arria II GX series Field Programmable Gate Array (FPGA) in a 572-ball FCBGA package. It provides a programmable logic fabric with a high count of logic elements, embedded memory, and a sizeable I/O complement for commercial electronic systems.

Designed for commercial-grade applications, this device targets designs that require dense programmable logic, on-chip RAM, and flexible I/O in a compact surface-mount 572-FBGA (25×25) package. Key electrical parameters include a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 42,959 logic elements for implementing complex digital logic and custom architectures.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM (total RAM bits: 3,517,440) to support buffering, FIFOs, and on-chip data storage.
• I/O and Package  252 general-purpose I/O pins in a 572-BGA FCBGA package (supplier device package: 572-FBGA, FC 25×25) suitable for dense board-level integration and surface-mount assembly.
• Power  Core voltage operating range specified at 870 mV to 930 mV to match system power-rail design requirements.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant to support environmentally regulated manufacturing.
• Family-Level Technical Foundation  Part of the Arria II device family; device documentation covers electrical characteristics, transceiver performance specifications, and I/O timing for system-level integration.

Typical Applications

• High-density digital logic  Implement custom datapaths, control logic, and state machines where significant logic resources and embedded RAM are required.
• Communications and interfaces  Leverage the Arria II GX device family’s documented transceiver and I/O characteristics for protocol bridging and interface aggregation.
• Prototyping and system integration  Use the device’s sizeable logic capacity and I/O count for board-level prototyping and consolidation of multiple functions into a single programmable device.

Unique Advantages

• High logic density:  42,959 logic elements enable complex designs without immediate need for multiple devices.
• Significant on-chip RAM:  Approximately 3.5 Mbits of embedded memory reduces dependence on external memory for many buffering and temporary-storage tasks.
• Substantial I/O availability:  252 I/O pins in a single FCBGA package simplify board routing and allow direct interfacing to multiple peripherals and buses.
• Compact surface-mount package:  572-FBGA (25×25) offers a small board footprint while supporting high pin count and reliable solder attachment.
• Commercial temperature rating:  Rated 0 °C to 85 °C to match standard commercial deployment environments.
• Regulatory readiness:  RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose EP2AGX45DF25C6N?

The EP2AGX45DF25C6N combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a compact 572-FBGA surface-mount package, making it well suited for commercial designs that require dense programmable logic and flexible interfacing. Its documented family-level electrical and transceiver characteristics support predictable system integration and power-rail planning.

This Arria II GX device is a practical choice for engineering teams seeking a commercially rated FPGA platform that balances logic capacity, on-chip memory, and board-level integration in applications where those attributes enable consolidation and design flexibility.

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