EP2AGX45DF25I3
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 252 3517440 42959 572-BGA, FCBGA |
|---|---|
| Quantity | 1,141 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 252 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1805 | Number of Logic Elements/Cells | 42959 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3517440 |
Overview of EP2AGX45DF25I3 – Arria II GX FPGA, 572-FBGA (25×25)
The EP2AGX45DF25I3 is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 572-FBGA FCBGA package. It delivers a combination of high logic capacity and on-chip memory in a compact surface-mount package suitable for industrial-grade designs.
Built on the Arria II GX device family architecture, the device provides a programmable logic fabric with integrated memory and I/O resources, along with documented electrical and transceiver characteristics that support complex digital designs requiring configurable logic and embedded RAM.
Key Features
- Logic Capacity 42,959 logic elements (cells) for implementing complex programmable logic functions and custom hardware accelerators.
- Embedded Memory Approximately 3.52 Mbits of on-chip RAM (3,517,440 bits) to support buffering, lookup tables, and local memory requirements.
- I/O Resources 252 available I/O pins to connect with peripherals, sensors, and board-level interfaces.
- Core Supply Range Core voltage supply specified between 870 mV and 930 mV to match system power-rail requirements.
- Package and Mounting 572-ball FCBGA (25×25) package, surface-mount mounting for compact PCB integration.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in extended-temperature environments.
- Arria II GX Family Characteristics Datasheet series documentation includes electrical characteristics, transceiver performance specifications, and I/O timing details such as programmable I/O element delay and programmable output buffer delay.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Programmable Logic Implementation Use the 42,959 logic elements to implement custom state machines, protocol handling, or hardware accelerators on a single device.
- Embedded Memory-Intensive Designs Leverage approximately 3.52 Mbits of on-chip RAM for buffering, LUT-based processing, and temporary data storage.
- I/O-Heavy Systems Deploy in designs requiring up to 252 I/O connections for interfacing with multiple peripherals or parallel sensors.
- Industrial and Ruggedized Equipment Designed for operation across –40 °C to 100 °C, making it suitable for industrial applications that demand extended temperature capability.
Unique Advantages
- High Logic Density: 42,959 logic elements provide substantial capacity for implementing complex logic without external ASICs.
- Substantial On-Chip RAM: Approximately 3.52 Mbits of embedded memory reduces dependence on external memory and simplifies board-level design.
- Generous I/O Count: 252 I/Os enable flexible interfacing and integration with a wide range of peripherals and subsystems.
- Industrial Temperature Rating: Operation from –40 °C to 100 °C supports deployment in demanding thermal environments.
- Compact FCBGA Package: The 572-ball FCBGA (25×25) package provides a space-efficient footprint for high-density PCB layouts.
- Documented Device Characteristics: Arria II GX family datasheet coverage includes electrical characteristics, transceiver specifications, and I/O timing controls to aid design validation and integration.
Why Choose EP2AGX45DF25I3?
The EP2AGX45DF25I3 combines a substantial logic element count with significant embedded memory and a high I/O count in a compact 572-FBGA package, positioned for industrial-grade applications that require programmable logic and reliable operation across extended temperatures. Its documented Arria II GX family characteristics—covering power, I/O timing, and transceiver behavior—make it a practical choice for designers who need verifiable electrical and timing parameters for system-level integration.
This device is suited for customers and designs prioritizing integrated logic capacity, on-chip RAM, and flexible I/O in a surface-mount FCBGA form factor, offering a balance of integration and environmental robustness for long-term deployments.
If you would like pricing, availability, or a formal quotation for EP2AGX45DF25I3, submit a quote request or contact sales to request a quote today.

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