EP2AGX45DF25I3

IC FPGA 252 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 252 3517440 42959 572-BGA, FCBGA

Quantity 1,141 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case572-BGA, FCBGANumber of I/O252Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1805Number of Logic Elements/Cells42959
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3517440

Overview of EP2AGX45DF25I3 – Arria II GX FPGA, 572-FBGA (25×25)

The EP2AGX45DF25I3 is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 572-FBGA FCBGA package. It delivers a combination of high logic capacity and on-chip memory in a compact surface-mount package suitable for industrial-grade designs.

Built on the Arria II GX device family architecture, the device provides a programmable logic fabric with integrated memory and I/O resources, along with documented electrical and transceiver characteristics that support complex digital designs requiring configurable logic and embedded RAM.

Key Features

  • Logic Capacity  42,959 logic elements (cells) for implementing complex programmable logic functions and custom hardware accelerators.
  • Embedded Memory  Approximately 3.52 Mbits of on-chip RAM (3,517,440 bits) to support buffering, lookup tables, and local memory requirements.
  • I/O Resources  252 available I/O pins to connect with peripherals, sensors, and board-level interfaces.
  • Core Supply Range  Core voltage supply specified between 870 mV and 930 mV to match system power-rail requirements.
  • Package and Mounting  572-ball FCBGA (25×25) package, surface-mount mounting for compact PCB integration.
  • Industrial Temperature Range  Rated for operation from –40 °C to 100 °C for deployment in extended-temperature environments.
  • Arria II GX Family Characteristics  Datasheet series documentation includes electrical characteristics, transceiver performance specifications, and I/O timing details such as programmable I/O element delay and programmable output buffer delay.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Programmable Logic Implementation  Use the 42,959 logic elements to implement custom state machines, protocol handling, or hardware accelerators on a single device.
  • Embedded Memory-Intensive Designs  Leverage approximately 3.52 Mbits of on-chip RAM for buffering, LUT-based processing, and temporary data storage.
  • I/O-Heavy Systems  Deploy in designs requiring up to 252 I/O connections for interfacing with multiple peripherals or parallel sensors.
  • Industrial and Ruggedized Equipment  Designed for operation across –40 °C to 100 °C, making it suitable for industrial applications that demand extended temperature capability.

Unique Advantages

  • High Logic Density:  42,959 logic elements provide substantial capacity for implementing complex logic without external ASICs.
  • Substantial On-Chip RAM:  Approximately 3.52 Mbits of embedded memory reduces dependence on external memory and simplifies board-level design.
  • Generous I/O Count:  252 I/Os enable flexible interfacing and integration with a wide range of peripherals and subsystems.
  • Industrial Temperature Rating:  Operation from –40 °C to 100 °C supports deployment in demanding thermal environments.
  • Compact FCBGA Package:  The 572-ball FCBGA (25×25) package provides a space-efficient footprint for high-density PCB layouts.
  • Documented Device Characteristics:  Arria II GX family datasheet coverage includes electrical characteristics, transceiver specifications, and I/O timing controls to aid design validation and integration.

Why Choose EP2AGX45DF25I3?

The EP2AGX45DF25I3 combines a substantial logic element count with significant embedded memory and a high I/O count in a compact 572-FBGA package, positioned for industrial-grade applications that require programmable logic and reliable operation across extended temperatures. Its documented Arria II GX family characteristics—covering power, I/O timing, and transceiver behavior—make it a practical choice for designers who need verifiable electrical and timing parameters for system-level integration.

This device is suited for customers and designs prioritizing integrated logic capacity, on-chip RAM, and flexible I/O in a surface-mount FCBGA form factor, offering a balance of integration and environmental robustness for long-term deployments.

If you would like pricing, availability, or a formal quotation for EP2AGX45DF25I3, submit a quote request or contact sales to request a quote today.

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