EP2AGX45DF25I3N

The EP2AGX45DF25I3N is an Intel Arria II GX-series FPGA offered in a 572-ball FCBGA package. It delivers a balanced combination of programmable logic, embedded memory, and I/O density targeted at industrial-grade embedded and communications designs.

As part of the Arria II GX device family, this device aligns with the family-level characteristics documented in the device handbook, including transceiver-capable architecture and configurable I/O timing and periphery options. The device is RoHS-compliant and rated for industrial temperature operation.

Key Features

• Logic Capacity  Approximately 42,959 logic elements for implementing custom digital logic, control functions, and glue logic.
• Embedded Memory  Approximately 3.52 Mbits of on-chip RAM to support buffering, LUT-based storage, and intermediate data processing.
• I/O Density  252 user I/O pins to accommodate wide bus interfaces, multiple peripherals, and high pin-count connectivity.
• Power  Core supply operating range of 870 mV to 930 mV to match system power rails and support core power optimization.
• Package & Mounting  572-ball FCBGA (572-BGA) package in a 25 × 25 mm footprint, surface-mountable for compact board designs.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Family-Level Peripherals  Arria II documentation describes device-level transceiver performance and programmable I/O timing, consistent with Arria II GX family capabilities.
• Regulatory  RoHS-compliant for reduced hazardous-substance content in manufacturing.

Typical Applications

• Industrial Automation  Implement real-time control logic, protocol bridging, and I/O expansion in factory and process-control systems using the device’s industrial temperature rating and I/O count.
• High-Speed Communications  Leverage Arria II GX family transceiver-capable architecture and programmable I/O to build networking interfaces and custom packet-processing functions.
• Embedded Systems  Use the on-chip memory and dense logic resources for embedded compute tasks, peripherals integration, and prototype hardware acceleration.
• Custom Interface and Glue Logic  Deploy the device to implement protocol conversion, timing adaptation, and aggregation of multiple digital interfaces on a single FPGA.

Unique Advantages

• HighLogic Density:  Approximately 42,959 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators without external ASICs.
• Significant On-Chip Memory:  Approximately 3.52 Mbits of embedded RAM reduce dependence on external memory for buffering and intermediate storage.
• Generous I/O Count:  252 I/Os support wide parallel interfaces and multiple peripheral connections, simplifying board-level routing and integration.
• Industrial Reliability:  Rated for –40 °C to 100 °C operation to meet the thermal demands of industrial and harsh-environment deployments.
• Compact, Surface-Mount Package:  572-BGA FCBGA in a 25 × 25 mm form factor provides a space-efficient solution for dense system designs.
• Low-Voltage Core Operation:  Core supply range of 870 mV–930 mV enables integration with contemporary low-voltage power architectures.

Why Choose EP2AGX45DF25I3N?

The EP2AGX45DF25I3N offers a practical combination of programmable logic capacity, embedded memory, and a high I/O count in an industrial-grade Arria II GX package. It is engineered for designs that require on-chip buffering, significant logic resources, and robust environmental tolerance.

This device is well suited to engineering teams working on industrial automation, communications interfaces, and embedded systems that prioritize integration and thermal resilience while leveraging the documented capabilities of the Arria II GX family.

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