EP2AGX45DF29C4

The EP2AGX45DF29C4 is an Arria II GX family FPGA provided in a 780-ball FCBGA (29×29) surface-mount package. It delivers a high-density programmable fabric with 42,959 logic elements, approximately 3.52 Mbits of embedded RAM, and 364 I/O pins for complex digital designs.

Targeted at commercial-grade applications, this device combines substantial logic and memory resources with a compact FBGA package and a core supply voltage range of 870 mV to 930 mV, operating across a 0 °C to 85 °C temperature range.

Key Features

• Programmable Logic Capacity — 42,959 logic elements to implement complex custom logic, state machines, and datapaths in a single device.
• Embedded Memory — Approximately 3.52 Mbits of on-chip RAM for buffering, lookup tables, and local data storage without external memory.
• Rich I/O Count — 364 I/O pins to support multiple parallel interfaces, bus connections, and mixed-signal front‑end requirements.
• Package and Mounting — 780-ball FCBGA (29×29) surface-mount package providing a compact footprint for board-level integration.
• Core Supply Range — Core voltage specified between 870 mV and 930 mV to match platform power architectures.
• Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C for commercial environment deployments.
• RoHS Compliant — Manufactured in accordance with RoHS requirements for lead-free processes.

Typical Applications

• Communications Equipment — Use the device’s high logic density and abundant I/O for protocol processing, packet parsing, and interface bridging in commercial network systems.
• Data Processing and Acceleration — Implement custom datapaths, parallel processing kernels, and buffering logic using the large logic element count and embedded RAM.
• Video and Image Processing — Deploy image pipelines, format conversion, and real-time preprocessing leveraging on-chip memory and extensive I/O.
• Prototyping and System Integration — Integrate multiple functions into one FPGA for rapid prototyping or consolidation of system logic on compact boards.

Unique Advantages

• High Logic Density: 42,959 logic elements enable consolidation of multiple functions into one device, reducing system complexity and bill of materials.
• Substantial On-Chip Memory: Approximately 3.52 Mbits of embedded RAM minimizes dependency on external memory for many buffering and LUT needs.
• Large I/O Count: 364 I/Os support complex interfacing and parallel connectivity without immediate need for external multiplexing.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Compact FBGA Packaging: 780-ball FCBGA (29×29) provides a dense, surface-mount solution suitable for space-constrained PCBs.
• Regulatory Compliance: RoHS-compliant construction supports lead-free manufacturing requirements.

Why Choose EP2AGX45DF29C4?

The EP2AGX45DF29C4 offers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 780-ball FCBGA package, making it well suited for commercial designs that require significant programmable logic and on-chip storage. Its specified core voltage range and commercial temperature rating make it straightforward to integrate into standard power and thermal plans.

Choose this device when you need to consolidate multiple digital functions, accelerate custom processing tasks, or prototype complex systems on a single, RoHS-compliant FPGA platform backed by the Arria II device family documentation.

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