EP2AGX45DF29C4N

The EP2AGX45DF29C4N is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780-ball FCBGA surface-mount package. It provides a high logic element count, multi-megabit on-chip RAM, and a large number of user I/O pins for designs that require substantial programmable logic and I/O integration within a commercial temperature range.

Designed for applications that need significant programmable resources and dense I/O, this device balances logic capacity, embedded memory, and compact package integration for system-level designs in commercial environments.

Key Features

• Logic Capacity  42,959 logic elements provide substantial programmable resource for complex digital designs.
• Embedded Memory  Approximately 3.52 Mbits of on-chip RAM (3,517,440 total RAM bits) to support buffering, state storage, and local data processing.
• I/O Count  364 user I/O pins to accommodate multiple interfaces and parallel connectivity requirements.
• Power Supply  Core voltage operating range of 870 mV–930 mV, enabling compatibility with designs targeting this supply domain.
• Package & Mounting  780-BBGA (FCBGA) surface-mount package; supplier device package listed as 780-FBGA (29×29) for compact board-level integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the device where large numbers of logic elements and embedded RAM support complex data-paths, control logic, or custom processing engines.
• Multi-interface systems  The 364 I/Os enable implementation of multiple parallel or serial interfaces and board-level connectivity within a single FPGA.
• Prototyping and system integration  A compact 780-ball FCBGA package and surface-mount mounting make the device suitable for integration into prototype and production PCBs in commercial products.

Unique Advantages

• High programmable density: 42,959 logic elements deliver significant on-chip logic to consolidate functions and reduce external components.
• Substantial embedded memory: Approximately 3.52 Mbits of RAM supports local buffering and state storage, reducing reliance on external memory for many functions.
• Broad I/O capability: 364 I/Os provide flexibility to connect diverse peripherals and interfaces without additional bridging devices.
• Compact board footprint: 780-FBGA (29×29) FCBGA package enables dense board-level integration while maintaining high resource counts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, matching standard commercial deployment requirements.
• RoHS compliant: Conforms to environmental requirements for lead-free assembly and regulatory conformity in many commercial products.

Why Choose EP2AGX45DF29C4N?

The EP2AGX45DF29C4N positions itself as a feature-rich Arria II GX FPGA option for engineers needing a balance of high logic capacity, multi-megabit on-chip RAM, and extensive I/O in a compact FCBGA package. Its commercial-grade temperature range and RoHS compliance make it suitable for a wide range of commercial electronic products that require integrated programmable logic resources.

Choose this device when your design calls for substantial programmable logic and embedded memory with a high pin count in a surface-mount, production-ready package; it supports scalable designs where consolidating functions into a single FPGA reduces BOM and simplifies board complexity.

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