EP2AGX45DF29C5N

The EP2AGX45DF29C5N is an Arria II GX field programmable gate array (FPGA) from Intel provided in a 780-BBGA (29×29) FCBGA package. It delivers substantial logic capacity and on-chip memory in a compact surface-mount package targeted at commercial-grade applications.

With 42,959 logic elements, approximately 3.52 Mbits of embedded RAM, and 364 I/O pins, this device is designed for designs that require dense programmable logic, significant embedded memory, and high I/O connectivity while operating at commercial temperature ranges.

Key Features

• Core Logic Capacity — 42,959 logic elements provide large-scale programmable logic resources for complex combinational and sequential designs.
• Embedded Memory — Approximately 3.52 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density — 364 user I/O pins to support multiple parallel interfaces and board-level connectivity requirements.
• Package and Mounting — 780-BBGA (FCBGA) 29×29 supplier device package in a surface-mount form factor for compact board integration.
• Power — Core voltage supply range specified at 870 mV to 930 mV for the device core power domain.
• Operating Grade and Temperature — Commercial grade, rated for 0 °C to 85 °C operating temperature.
• Compliance — RoHS compliant material and manufacturing status.
• Device Family Documentation — Part of the Arria II GX family; electrical and switching characteristics are documented in the Arria II device handbook and device datasheet.

Typical Applications

• High-density logic implementations — Use the device’s 42,959 logic elements to implement complex programmable logic and state machines.
• On-chip buffering and local memory — Leverage approximately 3.52 Mbits of embedded RAM for data buffering, FIFOs, and local storage.
• Multi-interface systems — Utilize 364 I/O pins to connect multiple peripherals, interfaces, or board-level signals.
• Compact commercial products — The 780-BBGA FCBGA package and surface-mount mounting suit space-constrained commercial designs operating within 0 °C to 85 °C.

Unique Advantages

• Substantial programmable logic: 42,959 logic elements enable implementation of large-scale logic and control functions without discrete ASIC development.
• Significant embedded memory: Approximately 3.52 Mbits of on-chip RAM reduces external memory dependencies for many buffering and processing tasks.
• High I/O count: 364 I/Os provide flexibility for interfacing multiple signals and peripherals on a single device.
• Compact FCBGA package: 780-BBGA (29×29) packaging delivers high pin count in a board-friendly surface-mount form factor.
• Commercial temperature rating: Rated 0 °C to 85 °C, appropriate for a wide range of non-industrial, commercial end products.
• Regulatory compliance: RoHS compliance supports environmentally conscious product assemblies.

Why Choose EP2AGX45DF29C5N?

The EP2AGX45DF29C5N combines a large logic resource pool with meaningful on-chip memory and a high I/O count in a compact 780-BBGA FCBGA package, making it a practical choice for commercial designs that require integrated programmable logic and moderate embedded storage. Its specified core voltage range and documented electrical characteristics provide clear parameters for system power delivery and integration.

This device is suitable for designers and procurement teams seeking a commercially graded Arria II GX FPGA with verified specifications for logic capacity, memory, I/O density, packaging, and operating conditions.

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