EP2AGX45DF29I3

The EP2AGX45DF29I3 is an Intel Arria II GX field programmable gate array (FPGA) offered in a 780-ball FBGA package. It delivers a high logic density of 42,959 logic elements with approximately 3.5 Mbits of embedded memory, making it suitable for designs that require significant on-chip logic and memory resources.

Built for industrial environments, this surface-mount FPGA provides 364 user I/O lines, a tight core voltage range (870 mV to 930 mV), and an extended operating temperature range from −40 °C to 100 °C. The device family documentation also highlights transceiver performance specifications and a PCI Express (PCIe) HIP block as part of the Arria II GX architecture.

Key Features

• Core and Logic — 42,959 logic elements for implementing complex custom logic and RTL designs.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM to support buffers, FIFOs, and embedded data storage.
• I/O Density — 364 user I/O pins to accommodate multiple interfaces, peripherals, and board-level connectivity.
• Power — Core supply operating range of 870 mV to 930 mV to match demanding core-voltage requirements.
• Package and Mounting — 780-ball FBGA (780-FBGA, 29×29) surface-mount package for compact, high-density PCB integration.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation to meet industrial-environment temperature needs.
• Standards and Compliance — RoHS-compliant to meet common environmental and regulatory requirements.
• Family-level Interfaces — Arria II GX device documentation includes transceiver and PCIe HIP block capabilities (as described in the Arria II Device Handbook).

Typical Applications

• High-speed serial and networking systems — Leverage the Arria II GX family transceiver specifications for board-level serial connectivity and protocol implementation.
• PCI Express-based modules — Use in add-in cards or systems that require PCIe interfaces, supported by the Arria II GX PCIe HIP block described in the device handbook.
• Industrial control and automation — Industrial-grade temperature rating and robust I/O count make the device suitable for factory automation, motor control, and process-control systems.

Unique Advantages

• Substantial logic capacity: 42,959 logic elements enable integration of sizable custom logic, signal processing, and control functions on a single device.
• Generous embedded RAM: Approximately 3.5 Mbits of on-chip memory reduce reliance on external memory for many buffering and data-path tasks.
• High I/O count: 364 user I/O pins support multi-channel interfaces and extensive board-level connectivity without complex multiplexing.
• Industrial-rated operation: −40 °C to 100 °C operating range and RoHS compliance suit long-life industrial deployments.
• Compact, high-density package: 780-FBGA (29×29) packaging allows dense placement on modern PCBs while maintaining high pin count.
• Documented high-speed features: Family datasheet coverage of transceivers and PCIe HIP block provides engineering-level detail for high-speed system design.

Why Choose EP2AGX45DF29I3?

The EP2AGX45DF29I3 positions itself as a high-density, industrial-grade Arria II GX FPGA option for designs that need a balance of logic capacity, embedded memory, and extensive I/O. Its specified operating voltage window and extended temperature rating support robust deployment in industrial applications while the family-level documentation details high-speed transceiver and PCIe capabilities for connectivity-focused systems.

Backed by Intel’s Arria II device documentation, this part is suited to engineering teams building complex FPGA-based designs that require verified device characteristics and comprehensive electrical guidance from the datasheet.

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