EP2AGX45DF29I3G

The EP2AGX45DF29I3G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers high logic capacity and on-chip memory in a surface-mount ball grid array designed for industrial environments.

With 42,959 logic elements, 364 user I/Os, and approximately 3.5 Mbits of embedded RAM, this device is aimed at designs that require significant programmable logic, abundant I/O, and operation across a wide industrial temperature range.

Key Features

• Programmable Logic Capacity – 42,959 logic elements to implement complex custom logic and datapath functions.
• Embedded Memory – Approximately 3.5 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
• I/O Resources – 364 user I/Os for broad interface consolidation and connectivity to external peripherals and transceivers.
• Power Supply Range – Supports core supply operation in the 870 mV to 930 mV range for designs targeting the specified voltage window.
• Package & Mounting – Supplied in a 780-ball FCBGA package (780-FBGA, 29×29) for high-density PCB implementations; surface-mount mounting type.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C, suitable for industrial applications that require extended temperature performance.
• Compliance – RoHS compliant for environmental regulatory adherence.

Typical Applications

• High-density I/O systems – 364 I/Os enable consolidation of multiple interfaces and external device connections on a single FPGA.
• Logic- and DSP-heavy designs – 42,959 logic elements provide capacity for complex control, signal processing, and protocol implementation.
• Embedded memory-dependent functions – Approximately 3.5 Mbits of on-chip RAM supports buffering, packet queues, and intermediate data storage without external memory for some workloads.
• Industrial control and automation – Rated for −40 °C to 100 °C operation and supplied as industrial-grade, making it suitable for factory and process automation environments.

Unique Advantages

• Substantial logic density: 42,959 logic elements allow integration of complex custom logic and multi-function designs, reducing the need for multiple discrete components.
• On-chip memory availability: Approximately 3.5 Mbits of embedded RAM helps minimize external memory dependency for many buffering and real-time processing tasks.
• High I/O count: 364 user I/Os enable flexible interfacing and system-level consolidation, simplifying board-level routing and BOM.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments where extended temperature ranges are required.
• Compact, manufacturable package: 780-ball FCBGA (29×29) surface-mount package provides a high-density footprint for space-constrained boards and automated assembly.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for modern product assemblies.

Why Choose EP2AGX45DF29I3G?

The EP2AGX45DF29I3G positions itself as a high-capacity, industrial-grade FPGA option that balances logic resources, embedded memory, and a large I/O complement within a compact 780-ball FCBGA package. Its specified core supply range and extended operating temperature make it suitable for designs that require reliable operation across varying environmental conditions.

This device is a fit for engineering teams building mid-to-high complexity systems where integration, predictable thermal range, and a high I/O count are priorities. Backed by Intel’s Arria II GX platform attributes, it offers a clear upgrade path for applications that need a robust, programmable hardware building block.

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