EP2AGX45DF29I3N

The EP2AGX45DF29I3N is an Arria II GX field programmable gate array (FPGA) packaged in a 780-FBGA (29×29) surface-mount package. It delivers programmable logic capacity, embedded memory, and a high I/O count in an industrial-grade device designed for robust embedded and industrial applications.

Built for designs that require substantial logic resources and flexible I/O, this device provides approximately 42,959 logic elements, about 3.5 Mbits of embedded memory, and 364 user I/Os while operating across an industrial temperature range.

Key Features

• Core Logic Capacity — Approximately 42,959 logic elements suitable for complex programmable logic implementations.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM to support buffering, state machines, and data processing functions.
• I/O Density — 364 user I/Os to support rich peripheral interfacing and multi-channel connectivity.
• Package & Mounting — 780-FBGA (29×29) / 780-BBGA, FCBGA in a surface-mount form factor for compact board-level integration.
• Power — Core supply operating range specified at 870 mV to 930 mV, enabling low-voltage core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Standards & Compliance — RoHS compliant.
• Series-Level Device Characteristics — As part of the Arria II device family, series documentation covers electrical and switching characteristics including transceiver and I/O timing performance (series-level reference).

Typical Applications

• Industrial Control Systems — Use the device’s industrial temperature rating and high I/O count for robust control, monitoring, and interfacing in factory and process automation.
• Communications & Networking — Leverage the device family’s switching and transceiver performance (series-level) together with abundant I/Os for protocol bridging and interface aggregation.
• Embedded Acceleration — Implement custom hardware acceleration and data-path logic using the large logic element count and embedded memory.
• Test & Measurement — Deploy for flexible signal conditioning, data capture, and processing tasks that require dense I/O and deterministic logic behavior.

Unique Advantages

• High Logic Density: Approximately 42,959 logic elements provide capacity for complex custom logic and integration of multiple functions into a single device.
• Significant On-Chip Memory: About 3.5 Mbits of embedded RAM simplifies buffering and stateful processing without external memory.
• Extensive I/O Footprint: 364 user I/Os enable broad interface support and multi-channel system integration.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in harsh and wide-temperature environments.
• Compact BGA Package: 780-FBGA (29×29) surface-mount package balances high pin count with board-area efficiency for dense system designs.
• Low-Voltage Core Operation: Core supply range of 870 mV to 930 mV supports low-voltage power architectures.

Why Choose EP2AGX45DF29I3N?

The EP2AGX45DF29I3N positions itself as a high-capacity, industrial-grade FPGA option within the Arria II GX family, combining substantial logic elements, embedded memory, and a large I/O count in a compact 780-FBGA footprint. Its specified core voltage range and wide operating temperature make it suitable for designers targeting reliable, compact implementations that require both density and durability.

This device is well suited to engineers and system architects building industrial control, communications, embedded acceleration, or test-and-measurement systems who need verifiable on-chip resources and a known industrial operating envelope. Series-level documentation provides detailed electrical and switching characteristics to support design validation.

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