EP2AGX45DF29I5G

The EP2AGX45DF29I5G is an Intel Arria II GX family Field Programmable Gate Array (FPGA) supplied in a 780-ball FCBGA package. It delivers a combination of programmable logic, embedded RAM, and a high pin-count I/O footprint for designs that require substantial on-chip logic and I/O resources.

Specified for industrial-grade operation with a wide operating temperature range and low-voltage core rails, this device is positioned for applications that demand reliable, high-density logic and memory integration in a surface-mount FCBGA package.

Key Features

• Logic Capacity  Approximately 42,959 logic elements providing substantial on-chip programmable logic for custom digital functions.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density  364 I/O pins to accommodate multiple interfaces and high-pin-count designs.
• Power  Core voltage supply range specified at 870 mV to 930 mV for low-voltage operation.
• Package and Mounting  780-BBGA / FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount format.
• Temperature and Grade  Industrial grade with an operating temperature range of −40°C to 100°C for extended-environment applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature rating and high logic capacity make this FPGA suitable for control and automation equipment requiring reliable operation across −40°C to 100°C.
• High-Density I/O Systems  With 364 I/Os in a 780-ball FCBGA package, the device fits designs that need many external interfaces or parallel connections.
• Embedded Processing and Logic Consolidation  The combination of ~43k logic elements and ~3.5 Mbits of RAM supports consolidation of custom logic, data handling, and local processing tasks on a single device.

Unique Advantages

• Substantial On-Chip Logic:  Approximately 42,959 logic elements enable complex custom logic implementations without immediate external logic expansion.
• Meaningful Embedded Memory:  Approximately 3.5 Mbits of on-chip RAM offers local storage for buffering and state machines, reducing external memory dependency.
• High I/O Count in an FCBGA:  364 available I/Os paired with a 780-FBGA (29×29) footprint supports dense interface routing in a surface-mount package.
• Industrial Temperature Rating:  Operation from −40°C to 100°C addresses applications that require extended temperature performance.
• Low-Voltage Core Support:  Specified core supply range (870 mV to 930 mV) for designs using low-voltage power domains.
• RoHS Compliant:  Meets RoHS requirements for environmental compliance.

Why Choose EP2AGX45DF29I5G?

The EP2AGX45DF29I5G delivers a blend of high logic element count, meaningful embedded memory, and a large I/O complement in a surface-mount 780-ball FCBGA package. Its industrial-grade temperature range and defined low-voltage core supply make it suited to designs that need dependable operation across extended environments while consolidating logic and memory on-chip.

This part is appropriate for engineering teams targeting mid-to-high density programmable logic implementations where a combination of logic capacity, on-chip RAM, and numerous I/Os in a compact package are key selection criteria.

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