EP2AGX45DF29I5N

The EP2AGX45DF29I5N is an Arria II GX family FPGA offered in a 780-ball FCBGA package. It provides a high-density programmable fabric with a defined count of logic resources, on-chip memory, and a large I/O complement for complex digital designs.

Designed for industrial-grade deployments, this device combines a core supply voltage operating window of 870 mV to 930 mV with an extended operating temperature range of –40 °C to 100 °C and RoHS compliance.

Key Features

• Logic Capacity  Approximately 42,959 logic elements, enabling substantial programmable logic integration within a single device.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM for data buffering, state storage, and local memory tasks.
• I/O Count  364 I/O pins to support broad interfacing options for parallel buses, control signals, and peripheral connections.
• Power and Core Voltage  Core supply range specified at 870 mV to 930 mV, suitable for the device’s power and timing requirements.
• Package and Mounting  780-BBGA (supplier package: 780-FBGA 29×29) package in a surface-mount format for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, aligning with industrial environmental requirements.
• Standards Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• Industrial control and automation  Industrial-grade rating and an extended temperature range make this device suitable for programmable logic tasks in factory and process control equipment.
• High-density logic integration  Large logic element count and broad I/O support integration of complex digital functions and custom peripherals on a single FPGA.
• On-chip buffering and state storage  Approximately 3.5 Mbits of embedded RAM enables local data buffering, temporary storage, and deterministic memory for real-time logic.

Unique Advantages

• Substantial programmable resources: The device’s ~42,959 logic elements provide designers room to implement complex state machines, datapaths, and control logic without partitioning across multiple devices.
• Generous I/O availability: 364 I/Os allow flexible interfacing to multiple peripherals, parallel buses, and board-level connectivity options.
• Embedded memory capacity: Approximately 3.5 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Industrial operating window: –40 °C to 100 °C rating and industrial grade designation support deployment in harsher environments.
• Compact surface-mount package: 780-ball FCBGA (29×29) provides a high-pin-count solution in a compact footprint for space-constrained boards.
• Regulatory compliance: RoHS compliance simplifies design-for-environment and manufacturing requirements.

Why Choose EP2AGX45DF29I5N?

EP2AGX45DF29I5N positions itself as a high-density Arria II GX-class FPGA suitable for industrial applications that require significant logic capacity, on-chip memory, and extensive I/O in a compact FCBGA package. The combination of approximately 42,959 logic elements, around 3.5 Mbits of embedded RAM, and 364 I/Os supports complex digital designs while minimizing external component count.

With a core supply window of 870 mV–930 mV, a surface-mount 780-ball package, and an operating temperature range of –40 °C to 100 °C, this device addresses designs that demand robustness, integration, and predictable environmental performance.

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