EP2AGX45DF29I3NAC

The EP2AGX45DF29I3NAC is an Arria II GX field-programmable gate array (FPGA) in a 780-ball FCBGA package designed for industrial applications. It delivers a combination of programmable logic capacity, embedded memory, and a broad I/O count to support complex digital designs requiring on-chip integration and configurable hardware resources.

Key Features

• Logic Capacity  Approximately 42,959 logic elements for implementing custom digital functions and datapaths.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM to store buffers, state machines, and lookup tables within the FPGA fabric.
• User I/O  364 user I/O pins to support multi-channel interfacing and system connectivity without external multiplexing.
• Power Supply Range  Core supply specification of 870 mV to 930 mV to match targeted board power architectures.
• Package and Mounting  780-BBGA / 780-FBGA (29×29) package case in FCBGA format with surface-mount attachment for compact PCB integration.
• Operating Temperature  Industrial temperature range from -40 °C to 100 °C for deployment in a wide range of environments.
• Industrial Grade  Specified as an industrial-grade device for applications that require wider operating temperature support.

Unique Advantages

• Substantial logic resources: The nearly 43k logic elements provide the capacity to implement complex custom logic, DSP blocks, and control functions on a single device.
• On-chip memory integration: Approximately 3.5 Mbits of embedded RAM reduces the need for external memory for many buffering and control tasks, simplifying board design.
• High I/O count: 364 I/O pins enable direct interfacing with multiple peripherals, sensors, or high-channel-count systems without extensive external glue logic.
• Industrial temperature support: Rated from -40 °C to 100 °C to support deployments where extended ambient ranges are required.
• Compact FCBGA packaging: 780-ball FCBGA (29×29) package allows a dense footprint and surface-mount manufacturing for space-constrained PCBs.

Why Choose EP2AGX45DF29I3NAC?

The EP2AGX45DF29I3NAC positions itself as a configurable, industrial-grade FPGA option that balances substantial logic resources, embedded RAM, and a high I/O count within a compact 780-ball FCBGA package. Its specified core voltage range and extended operating temperature make it suitable for designs that require on-board integration and reliable operation across varied environments.

This device is well suited for engineers and procurement teams seeking a programmable silicon building block that consolidates logic, memory, and I/O on a single component—providing scalability and reduced board-level complexity while leveraging established FPGA design flows and toolchains.

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