EP2AGX45DF29I3NAD

The EP2AGX45DF29I3NAD is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel provided in a 780-ball FCBGA package (29×29). It delivers a combination of high logic capacity, embedded memory, and a substantial I/O count in a surface-mount BGA footprint.

With 42,959 logic elements, approximately 3.5 Mbits of on-chip RAM and 364 I/Os, this industrial-grade device is specified to operate from -40 °C to 100 °C and runs on a core voltage between 870 mV and 930 mV—making it suitable for designs that require significant programmable logic, memory, and connectivity in a compact package.

Key Features

• Logic Capacity — 42,959 logic elements and 1,805 logic blocks provide the programmable resources to implement complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing without external memory dependencies.
• I/O Density — 364 accessible I/O pins to support multiple interfaces, parallel data paths, and extensive external connectivity.
• Power — Core voltage supply specified between 870 mV and 930 mV to meet device power requirements.
• Package and Mounting — 780-ball BGA (FCBGA) surface-mount package, 29×29 footprint for high-density PCB integration.
• Thermal Range — Industrial operating temperature range from -40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Systems — Industrial-grade temperature specification makes the device suitable for control and automation equipment requiring reliable programmable logic over a wide temperature range.
• High-density Digital Designs — The combination of 42,959 logic elements and ~3.5 Mbits of embedded RAM supports implementation of complex digital signal processing and custom logic functions.
• I/O-intensive Interfaces — 364 I/Os enable designs that require multiple external connections, parallel buses, and interface bridging.

Unique Advantages

• High Logic and Memory Integration: The large logic element count combined with approximately 3.5 Mbits of on-chip RAM reduces the need for external programmable logic or memory components.
• Robust I/O Capacity: 364 I/Os allow dense interfacing to peripherals and external devices, simplifying board-level partitioning.
• Industrial Temperature Rating: Rated from -40 °C to 100 °C, supporting deployments in environments with wide temperature variation.
• Compact Surface-Mount Package: The 780-FBGA (29×29) package enables high-density PCB layouts while maintaining thermal and mechanical integrity.
• Controlled Core Voltage: A defined supply range of 870 mV to 930 mV helps ensure predictable power and timing characteristics when integrated into designs.

Why Choose EP2AGX45DF29I3NAD?

The EP2AGX45DF29I3NAD is positioned for designs that require substantial programmable logic, on-chip memory, and a high number of I/Os within an industrial temperature-rated surface-mount BGA package. Its specification set—42,959 logic elements, approximately 3.5 Mbits of embedded RAM, 364 I/Os, and a 780-ball FCBGA footprint—provides a balanced platform for implementing complex digital functions while simplifying board-level integration.

Backed by Intel as the manufacturer and compliant with RoHS, this FPGA suits engineers and purchasers looking for a reliable, high-capacity programmable device for industrial and high-density digital applications where predictable electrical and thermal characteristics are required.

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