EP2AGX45DF29I5

The EP2AGX45DF29I5 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It provides a high-density programmable logic fabric with a large I/O count and on-chip embedded memory for complex digital designs.

Targeted at industrial-grade applications, this device combines approximately 42,959 logic elements, roughly 3.5 Mbits of embedded RAM, and 364 programmable I/Os to support designs requiring substantial logic capacity, memory, and connectivity while operating across an extended temperature range.

Key Features

• Logic Capacity — Approximately 42,959 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate data storage without external memory.
• High I/O Count — 364 programmable I/Os for wide parallel interfaces, multiple peripheral connections, and high-pin-count system integration.
• Package — 780-BBGA / 780-FBGA (29×29) FCBGA package providing a high-density footprint for board-level integration.
• Industrial Grade — Device grade listed as Industrial with an operating temperature range of –40 °C to 100 °C for reliable operation in extended-temperature environments.
• Core Voltage — Core supply voltage range specified at 870 mV to 930 mV to match platform power-rail requirements.
• Mounting — Surface-mount package suitable for standard PCB assembly processes.
• Standards Compliance — RoHS compliant for regulatory conformance in electronics manufacturing.

Typical Applications

• High-density programmable logic — Implement custom digital functions and accelerators using the device’s large logic element count and embedded RAM.
• Multi-interface systems — Support designs that require many parallel or serial interfaces with the device’s 364 I/Os.
• Industrial control and instrumentation — Maintain reliable operation across –40 °C to 100 °C for demanding environmental conditions.

Unique Advantages

• Significant logic resources: Approximately 42,959 logic elements enable integration of substantial custom logic into a single device, reducing board-level complexity.
• On-chip memory capacity: Approximately 3.5 Mbits of embedded RAM reduces dependence on external memory for buffering and data processing.
• Extensive I/O availability: 364 I/Os support broad connectivity and simplify routing of multiple peripherals and interfaces.
• Industrial temperature tolerance: Rated for –40 °C to 100 °C operation to support systems deployed in harsh or uncontrolled environments.
• High-density FCBGA packaging: 780-ball FCBGA (29×29) delivers a compact, manufacturable footprint for space-constrained PCBs.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with modern low-voltage power architectures.

Why Choose EP2AGX45DF29I5?

The EP2AGX45DF29I5 Arria II GX FPGA brings together a high logic element count, substantial embedded memory, and a large I/O complement in an industrial-grade FCBGA package. These attributes make it well suited for engineers designing complex digital systems that require dense logic, on-chip storage, and broad connectivity while operating across extended temperatures.

Backed by Arria II device documentation and Intel’s device family support, this part offers a clear path for integrating sizable programmable logic into industrial applications where reliability, integration density, and defined electrical characteristics are important.

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