EP2AGX65CU17C4

The EP2AGX65CU17C4 is an Intel Arria II GX family Field Programmable Gate Array (FPGA) in a 358‑LFBGA (FCBGA) package. It provides a programmable logic fabric with a substantial complement of logic elements and embedded memory tailored for commercial embedded applications.

With 60,214 logic elements, approximately 5.37 Mbits of on‑chip RAM and 156 I/O pins, this device targets designs that require dense programmable logic, on‑chip storage and flexible board‑level connectivity while meeting commercial temperature and RoHS requirements.

Key Features

• Programmable Logic Capacity — 60,214 logic elements (cells) for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 5.37 Mbits of on‑chip RAM to support buffering, state retention and memory‑intensive logic blocks.
• I/O Resources — 156 device I/O pins to accommodate a variety of parallel interfaces and external device connections.
• Power Supply — Core supply voltage range specified at 870 mV to 930 mV to guide power budgeting and regulator selection.
• Package and Mounting — 358‑LFBGA (358‑UBGA, FCBGA) 17×17 supplier device package; surface‑mount for compact board integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for commercial deployments.
• Standards Compliance — RoHS compliant, supporting environmental and regulatory requirements for commercial electronics.
• Device Family Documentation — Arria II device handbook and datasheet provide electrical and switching characteristics, including transceiver and I/O timing information for the Arria II GX family.

Typical Applications

• Custom digital logic and control — Implement state machines, protocol handlers and hardware accelerators using the device’s logic capacity and embedded memory.
• I/O‑intensive interfaces and bridging — Use the 156 I/O pins for parallel interfaces, board‑level bridging and custom signaling requirements.
• Space‑constrained board designs — The 358‑LFBGA surface‑mount package supports high‑density PCB layouts where compact packaging is required.
• Commercial embedded systems — The device’s 0 °C to 85 °C rating and RoHS compliance align with commercial product requirements.

Unique Advantages

• High logic density: 60,214 logic elements provide the resources needed for substantial custom logic integration on a single device.
• Significant on‑chip RAM: Approximately 5.37 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage needs.
• Flexible board connectivity: 156 I/O pins enable broad interfacing options for sensors, controllers and parallel buses.
• Compact FCBGA package: 358‑LFBGA (17×17) packaging supports compact, high‑density PCB designs and surface‑mount assembly.
• Defined power envelope: A core voltage range of 870 mV to 930 mV simplifies power supply design and thermal planning.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for commercial deployments and regulatory alignment.

Why Choose EP2AGX65CU17C4?

The EP2AGX65CU17C4 combines a substantial programmable logic fabric with meaningful on‑chip memory and a generous I/O count in a compact FCBGA package. As a member of the Arria II GX family from Intel, it is supported by comprehensive device documentation covering electrical characteristics, switching behavior and periphery details—enabling informed integration into commercial embedded designs.

This device is suitable for design teams seeking a commercially rated FPGA with focused logic and memory resources for protocol handling, custom logic, and I/O‑dense applications where board space and regulatory compliance matter.

Request a quote to obtain pricing and availability for EP2AGX65CU17C4 and to discuss how it fits your next commercial FPGA design.