EP2AGX65CU17C5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 156 5371904 60214 358-LFBGA, FCBGA |
|---|---|
| Quantity | 1,508 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 358-UBGA, FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 358-LFBGA, FCBGA | Number of I/O | 156 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2530 | Number of Logic Elements/Cells | 60214 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5371904 |
Overview of EP2AGX65CU17C5G – Arria II GX FPGA, 358-LFBGA FCBGA (17×17)
The EP2AGX65CU17C5G is an Arria II GX Field Programmable Gate Array (FPGA) IC in a 358-LFBGA/FCBGA package. As a programmable logic device, it delivers a balance of programmable logic resources, embedded memory, and flexible I/O for designs that require on-chip customization and interfacing.
With 60,214 logic elements, approximately 5.37 Mbits of embedded memory and 156 I/Os, this device targets commercial applications requiring moderate-density programmable logic, integrated memory, and configurable I/O in a surface-mount FPGA package.
Key Features
- Core Logic — Provides 60,214 logic elements for implementing custom digital logic, control functions, and state machines.
- Embedded Memory — Approximately 5.37 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- I/O Capacity — 156 user I/Os to support multiple peripheral interfaces and external device connectivity.
- Power — Operates from a core supply range of 870 mV to 930 mV, enabling defined power planning for board design.
- Package and Mounting — Available in a 358-LFBGA, FCBGA (358-UBGA, FCBGA 17×17) surface-mount package for compact board integration.
- Thermal/Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Custom Digital Logic — Implement bespoke digital functions and state machines using 60,214 logic elements to tailor logic to project requirements.
- Embedded Memory Applications — Use approximately 5.37 Mbits of on-chip RAM for data buffering, LUTs, and temporary storage within FPGA-based systems.
- I/O-Intensive Designs — Leverage 156 I/Os for interfacing with sensors, peripherals, or external devices in compact system designs.
- Prototyping and Development — Surface-mount FCBGA packaging and comprehensive logic resources make this device suitable for system prototypes and evaluation boards.
Unique Advantages
- Balanced Logic and Memory: 60,214 logic elements combined with approximately 5.37 Mbits of embedded RAM provide the resources needed for moderate-complexity designs without external memory dependencies.
- Flexible I/O Count: 156 I/Os allow designers to support multiple interfaces and peripherals directly from the FPGA fabric.
- Compact Surface-Mount Package: The 358-LFBGA/FCBGA (17×17) package enables high-density board integration while maintaining thermal and routing considerations for production PCBs.
- Defined Power Envelope: Core supply range of 870 mV to 930 mV supports predictable power budgeting and regulator selection during system design.
- Commercial Temperature Range: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
- RoHS Compliant: Conforms to lead-free requirements for modern manufacturing and regulatory needs.
Why Choose EP2AGX65CU17C5G?
The EP2AGX65CU17C5G Arria II GX FPGA offers a practical combination of logic density, embedded memory, and I/O capability in a compact FCBGA package. Its specifications support a wide range of commercial FPGA designs where on-chip programmability, local memory, and flexible interfacing are required.
This device is well suited for engineers and procurement teams working on mid-density programmable logic solutions that require a surface-mount, RoHS-compliant FPGA with defined voltage and temperature characteristics. Its resource balance and package options provide a scalable choice for board-level integration and prototype-to-production transitions.
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