EP2AGX65CU17C5G

IC FPGA 156 I/O 358UBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 156 5371904 60214 358-LFBGA, FCBGA

Quantity 1,508 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package358-UBGA, FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case358-LFBGA, FCBGANumber of I/O156Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65CU17C5G – Arria II GX FPGA, 358-LFBGA FCBGA (17×17)

The EP2AGX65CU17C5G is an Arria II GX Field Programmable Gate Array (FPGA) IC in a 358-LFBGA/FCBGA package. As a programmable logic device, it delivers a balance of programmable logic resources, embedded memory, and flexible I/O for designs that require on-chip customization and interfacing.

With 60,214 logic elements, approximately 5.37 Mbits of embedded memory and 156 I/Os, this device targets commercial applications requiring moderate-density programmable logic, integrated memory, and configurable I/O in a surface-mount FPGA package.

Key Features

  • Core Logic — Provides 60,214 logic elements for implementing custom digital logic, control functions, and state machines.
  • Embedded Memory — Approximately 5.37 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • I/O Capacity — 156 user I/Os to support multiple peripheral interfaces and external device connectivity.
  • Power — Operates from a core supply range of 870 mV to 930 mV, enabling defined power planning for board design.
  • Package and Mounting — Available in a 358-LFBGA, FCBGA (358-UBGA, FCBGA 17×17) surface-mount package for compact board integration.
  • Thermal/Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • Custom Digital Logic — Implement bespoke digital functions and state machines using 60,214 logic elements to tailor logic to project requirements.
  • Embedded Memory Applications — Use approximately 5.37 Mbits of on-chip RAM for data buffering, LUTs, and temporary storage within FPGA-based systems.
  • I/O-Intensive Designs — Leverage 156 I/Os for interfacing with sensors, peripherals, or external devices in compact system designs.
  • Prototyping and Development — Surface-mount FCBGA packaging and comprehensive logic resources make this device suitable for system prototypes and evaluation boards.

Unique Advantages

  • Balanced Logic and Memory: 60,214 logic elements combined with approximately 5.37 Mbits of embedded RAM provide the resources needed for moderate-complexity designs without external memory dependencies.
  • Flexible I/O Count: 156 I/Os allow designers to support multiple interfaces and peripherals directly from the FPGA fabric.
  • Compact Surface-Mount Package: The 358-LFBGA/FCBGA (17×17) package enables high-density board integration while maintaining thermal and routing considerations for production PCBs.
  • Defined Power Envelope: Core supply range of 870 mV to 930 mV supports predictable power budgeting and regulator selection during system design.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation for mainstream commercial applications.
  • RoHS Compliant: Conforms to lead-free requirements for modern manufacturing and regulatory needs.

Why Choose EP2AGX65CU17C5G?

The EP2AGX65CU17C5G Arria II GX FPGA offers a practical combination of logic density, embedded memory, and I/O capability in a compact FCBGA package. Its specifications support a wide range of commercial FPGA designs where on-chip programmability, local memory, and flexible interfacing are required.

This device is well suited for engineers and procurement teams working on mid-density programmable logic solutions that require a surface-mount, RoHS-compliant FPGA with defined voltage and temperature characteristics. Its resource balance and package options provide a scalable choice for board-level integration and prototype-to-production transitions.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX65CU17C5G. Our team can provide lead-time details and assist with volume pricing requests.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up