EP2AGX65CU17C6N

The EP2AGX65CU17C6N is an Intel Arria II GX field programmable gate array (FPGA) in a 358-LFBGA (FCBGA) package. It delivers a balance of programmable logic capacity, embedded RAM, and I/O resources for commercial-grade electronic designs.

With 60,214 logic elements and approximately 5.37 Mbits of on-chip RAM, this device targets applications that require substantial programmable logic and embedded memory combined with a moderate I/O count and surface-mount packaging for board-level integration.

Key Features

• Programmable Logic Capacity 60,214 logic elements provide the core programmable resources for implementing custom logic, datapaths, and control functions.
• Embedded Memory Total on-chip RAM: 5,371,904 bits (approximately 5.37 Mbits) to support buffering, FIFO, and state storage without external memory.
• I/O Resources 156 user I/O pins to interface with peripherals, sensors, and board-level signals.
• Power Supply Range Core voltage supply range from 870 mV to 930 mV, enabling predictable core-power planning and decoupling design.
• Package & Mounting 358-LFBGA (FCBGA) package; supplier device package listed as 358-UBGA (17×17). Surface-mount mounting type supports compact PCB layouts.
• Commercial Grade & Temperature Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Embedded Systems — Implement custom peripherals, control logic, and glue-logic using the device's logic capacity and on-chip RAM.
• Prototyping & Development — Use the FPGA's programmable fabric and memory for validating digital designs and iterative development.
• Data Handling & Buffering — On-chip RAM and abundant logic elements support buffering, packet handling, and intermediate data processing tasks.

Unique Advantages

• Substantial Logic Density: 60,214 logic elements enable integration of complex logic functions on a single device, reducing external component count.
• On-Chip Memory: Approximately 5.37 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
• Balanced I/O Count: 156 I/O pins provide flexibility to connect to multiple peripherals and interfaces without excessive board routing complexity.
• Compact Surface-Mount Package: 358-LFBGA/358-UBGA (17×17) package supports high-density PCB design and automated assembly.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for use in standard commercial electronic products and environments.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose EP2AGX65CU17C6N?

The EP2AGX65CU17C6N Arria II GX FPGA combines a significant logic element count with multi-megabit on-chip RAM and a moderate I/O complement in a compact surface-mount BGA package. These characteristics make it well suited to designers who need to consolidate logic, buffering, and interfacing onto a single programmable device while maintaining a commercial temperature profile.

Supported by Intel documentation for the Arria II family, the device is appropriate for development, prototyping, and production designs where predictable core voltage planning, on-chip memory, and RoHS compliance are required.

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