EP2AGX65CU17I3N

The EP2AGX65CU17I3N is an Arria II GX field programmable gate array (FPGA) IC from Intel, supplied in a 358-ball FCBGA package. It combines a low-power 40‑nm FPGA architecture with a substantial logic and memory resource set, targeted at industrial applications that require flexible, programmable logic, high I/O count, and extended temperature support.

This device is suited for designs that need on-chip logic density, embedded memory, and a range of I/O options, while operating across a wide industrial temperature range and a defined core voltage window.

Key Features

• Logic Capacity — 60,214 logic elements for implementing complex FPGA designs and custom logic functions.
• Logic Array Blocks (LABs) — 2,530 LABs to organize and optimize logic placement and routing within the device.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM for FIFOs, buffers, and mid-sized data storage.
• I/O and Packaging — 156 I/O pins provided in a 358-LFBGA FCBGA package; supplier package specified as 358-UBGA, FCBGA (17×17 mm) for compact board-level integration.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling defined power budgeting and regulator selection.
• Operating Environment — Industrial-grade operation rated from −40 °C to 100 °C for extended temperature applications.
• Family-Level Interfaces and IP — Arria II device family includes integrated support and IP for common interfaces such as PCIe, Ethernet, DDR3, and high-speed serial protocols, plus DSP blocks and hard arithmetic functions to accelerate signal-processing tasks.
• Compliance — RoHS compliant for environmental and regulatory requirements.

Typical Applications

• High‑performance networking and communications — Use for protocol bridging, packet processing, and implementing serial interfaces supported by the Arria II family IP.
• Digital signal processing (DSP) — Implement DSP pipelines, multiplies and accumulators using the family’s DSP blocks and embedded memory.
• Industrial control and automation — Deploy in control systems and data acquisition where industrial temperature range and programmable logic are required.
• Memory interface and buffering — Leverage on‑chip RAM and logic to implement DDR3 interfaces and buffering schemes using family-level IP.

Unique Advantages

• Substantial on-chip resources: 60,214 logic elements and approximately 5.37 Mbits of embedded memory provide the capacity to integrate complex functions on a single device, reducing external BOM.
• Industrial operating range: Rated −40 °C to 100 °C for deployment in systems that require extended temperature tolerance.
• Defined core voltage window: 870–930 mV supply allows predictable power design and thermal planning at the board level.
• Compact, board-ready packaging: 358-ball FCBGA (supplier: 358-UBGA, 17×17) supports dense PCB layouts while exposing 156 I/O for flexible system interfacing.
• Family-level interface and IP support: Access to Arria II family IP for serial protocols, PCIe, Ethernet, and memory interfaces to accelerate design integration.

Why Choose EP2AGX65CU17I3N?

The EP2AGX65CU17I3N positions itself as a capable, industrial-grade FPGA option within the Arria II GX family, offering a balance of logic density, embedded memory, and I/O resources in a compact FCBGA package. Its specified voltage range and temperature rating make it suitable for professional embedded designs that require stable, predictable electrical and thermal characteristics.

For engineers and procurement teams building mid-to-high complexity systems—particularly in networking, DSP, and industrial control—the device delivers the on-chip resources and family-level IP that help reduce board-level components and accelerate time-to-market while maintaining RoHS compliance.

Request a quote or submit a sales inquiry to evaluate EP2AGX65CU17I3N for your next design and to obtain availability and pricing details.