EP2AGX65CU17I5NAA

IC FPGA 156 I/O 358UBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 156 5371904 60214 358-LFBGA, FCBGA

Quantity 443 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package358-UBGA, FCBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case358-LFBGA, FCBGANumber of I/O156Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65CU17I5NAA – Arria II GX FPGA, 358-LFBGA / FCBGA, Industrial

The EP2AGX65CU17I5NAA is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 358-LFBGA FCBGA package. It provides a substantial logic capacity and embedded memory while supporting a wide industrial operating temperature range and surface-mount deployment.

Key on-chip resources include 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and up to 156 I/Os, making this device suitable for designs that require mid-to-high logic density, significant internal storage, and robust I/O counts within an industrial temperature envelope.

Key Features

  • Logic Capacity 60,214 logic elements to implement custom digital logic, state machines, and glue-logic functions.
  • Embedded Memory Approximately 5.37 Mbits of on-chip RAM for data buffering, FIFOs, and local storage close to logic.
  • I/O Resources 156 general-purpose I/Os to support multiple interfaces and external device connectivity.
  • Power Supply Operates from an internal supply range of 870 mV to 930 mV to meet device core voltage requirements.
  • Package & Mounting Available in a 358-LFBGA FCBGA package (358-UBGA, 17×17) with surface-mount mounting for PCB integration.
  • Temperature Range Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
  • RoHS Compliance Environmentally compliant with RoHS requirements.

Unique Advantages

  • Significant Logic Density: 60,214 logic elements provide ample capacity for complex FPGA designs without immediately moving to larger devices.
  • Substantial On-Chip Memory: Approximately 5.37 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
  • Generous I/O Count: 156 I/Os enable multiple peripheral connections and flexible interface implementation on a single device.
  • Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation across a wide range of field environments.
  • Compact BGA Packaging: 358-LFBGA (17×17) FCBGA packaging offers a high-pin-count, surface-mount form factor suitable for dense PCB layouts.

Why Choose EP2AGX65CU17I5NAA?

The EP2AGX65CU17I5NAA Arria II GX FPGA combines a large logic element count, significant embedded memory, and a substantial I/O complement in a compact BGA package rated for industrial temperatures. These characteristics make it a practical choice for engineers who need a balanced mix of logic capacity, local memory, and I/O flexibility within constrained board space and industrial operating conditions.

For development and production designs that require measurable on-chip resources and industrial-grade temperature performance, this device offers a clear, spec-driven option backed by the Arria II GX family pedigree.

If you would like pricing or availability, request a quote or submit a quote request referencing part number EP2AGX65CU17I5NAA. Our team will respond with lead time and purchasing options.

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