EP2AGX65CU17I5NAA
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 156 5371904 60214 358-LFBGA, FCBGA |
|---|---|
| Quantity | 443 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 358-UBGA, FCBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 358-LFBGA, FCBGA | Number of I/O | 156 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2530 | Number of Logic Elements/Cells | 60214 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 5371904 |
Overview of EP2AGX65CU17I5NAA – Arria II GX FPGA, 358-LFBGA / FCBGA, Industrial
The EP2AGX65CU17I5NAA is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 358-LFBGA FCBGA package. It provides a substantial logic capacity and embedded memory while supporting a wide industrial operating temperature range and surface-mount deployment.
Key on-chip resources include 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and up to 156 I/Os, making this device suitable for designs that require mid-to-high logic density, significant internal storage, and robust I/O counts within an industrial temperature envelope.
Key Features
- Logic Capacity 60,214 logic elements to implement custom digital logic, state machines, and glue-logic functions.
- Embedded Memory Approximately 5.37 Mbits of on-chip RAM for data buffering, FIFOs, and local storage close to logic.
- I/O Resources 156 general-purpose I/Os to support multiple interfaces and external device connectivity.
- Power Supply Operates from an internal supply range of 870 mV to 930 mV to meet device core voltage requirements.
- Package & Mounting Available in a 358-LFBGA FCBGA package (358-UBGA, 17×17) with surface-mount mounting for PCB integration.
- Temperature Range Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environmental conditions.
- RoHS Compliance Environmentally compliant with RoHS requirements.
Unique Advantages
- Significant Logic Density: 60,214 logic elements provide ample capacity for complex FPGA designs without immediately moving to larger devices.
- Substantial On-Chip Memory: Approximately 5.37 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
- Generous I/O Count: 156 I/Os enable multiple peripheral connections and flexible interface implementation on a single device.
- Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation across a wide range of field environments.
- Compact BGA Packaging: 358-LFBGA (17×17) FCBGA packaging offers a high-pin-count, surface-mount form factor suitable for dense PCB layouts.
Why Choose EP2AGX65CU17I5NAA?
The EP2AGX65CU17I5NAA Arria II GX FPGA combines a large logic element count, significant embedded memory, and a substantial I/O complement in a compact BGA package rated for industrial temperatures. These characteristics make it a practical choice for engineers who need a balanced mix of logic capacity, local memory, and I/O flexibility within constrained board space and industrial operating conditions.
For development and production designs that require measurable on-chip resources and industrial-grade temperature performance, this device offers a clear, spec-driven option backed by the Arria II GX family pedigree.
If you would like pricing or availability, request a quote or submit a quote request referencing part number EP2AGX65CU17I5NAA. Our team will respond with lead time and purchasing options.

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