EP2AGX65CU17I5N

The EP2AGX65CU17I5N is an Intel Arria II GX field programmable gate array supplied in a 358-ball LFBGA/FCBGA package. It provides approximately 60,214 logic elements and approximately 5.37 Mbits of embedded memory in a surface-mount, 17 × 17 package footprint, and is offered in an industrial grade configuration.

Designed for applications that require high logic density, significant on‑chip RAM capacity and a moderate I/O count, this device targets industrial designs where operating range, compact packaging, and power characteristics are important design parameters.

Key Features

• Core Logic  Approximately 60,214 logic elements provide substantial programmable fabric for complex logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffering, FIFOs, and embedded storage without external memory.
• I/O  156 I/Os to support multiple interfaces and peripheral connections within a compact package.
• Power  Core supply range specified at 870 mV to 930 mV, enabling predictable core power provisioning and integration with system power rails.
• Package & Mounting  358-LFBGA / FCBGA package in a 358-UBGA (17 × 17) supplier package; surface-mount mounting for space-efficient PCB layout.
• Temperature & Grade  Industrial-grade device rated for an operating range of −40 °C to 100 °C to meet broader environmental requirements.
• Standards Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control  Embedded logic and on-chip RAM support control algorithms, sensor interfacing and deterministic I/O handling in industrial environments within the device’s −40 °C to 100 °C rating.
• Signal Processing & Data Handling  Large logic capacity and several Mbits of embedded memory enable custom datapaths, buffering and packet handling for mid‑range signal processing tasks.
• Networking & Communications  The combination of significant programmable logic and 156 I/O pins accommodates glue logic, protocol handling and peripheral interfacing in communications equipment.
• Custom Embedded Systems  Compact 17 × 17 FCBGA package and surface-mount mounting make the device suitable for space-conscious designs that require substantial programmable resources.

Unique Advantages

• High logic density: Approximately 60,214 logic elements allow implementation of complex control and datapath functions on a single device.
• Significant embedded memory: Approximately 5.37 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Ample I/O count: 156 I/Os provide flexibility for interfacing to peripherals, sensors and external logic without immediate expansion.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in harsher thermal environments.
• Compact BGA packaging: 358-ball LFBGA/FCBGA in a 17 × 17 supplier package enables high-density PCB integration with a surface-mount footprint.
• Predictable core power envelope: Core supply specified from 870 mV to 930 mV for clear power-supply planning and thermal considerations.

Why Choose EP2AGX65CU17I5N?

The EP2AGX65CU17I5N pairs a high count of logic elements with multi‑Mbit embedded RAM and a practical I/O complement in a compact industrial-grade package. This combination makes it appropriate for engineers seeking a balanced FPGA solution where on‑chip memory, I/O flexibility and operation across an extended temperature range are required.

For development efforts that demand predictable power requirements and a surface-mount BGA footprint, the EP2AGX65CU17I5N offers a clear specification set that supports robust industrial designs and scalable implementations within the Arria II GX family.

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