EP2AGX65DF25C4N

The EP2AGX65DF25C4N is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572-FBGA FCBGA package. It provides a mid-to-high density programmable logic fabric with a significant on-chip memory complement and a substantial number of general-purpose I/Os for custom digital designs.

Designed for commercial-grade applications, this surface-mount FPGA combines approximately 60,214 logic elements with roughly 5.37 Mbits of embedded memory and 252 I/Os to support complex programmable logic, memory-intensive functions, and flexible interfacing in a compact package.

Key Features

• Logic Capacity — Approximately 60,214 logic elements suitable for complex custom digital implementations.
• Embedded Memory — Total on-chip RAM of 5,371,904 bits (approximately 5.37 Mbits) to support buffering, lookup tables, and data paths.
• I/O Count — 252 user I/Os for broad connectivity to peripherals, memory, and high-speed interfaces.
• Package & Mounting — 572-ball FBGA (FCBGA) package; supplier device package listed as 572-FBGA, FC (25×25); surface-mount design for standard PCB assembly.
• Power Supply — Core voltage supply range of 870 mV to 930 mV, enabling defined core power budgeting in system design.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Custom Digital Processing — Use the device's ~60,214 logic elements and embedded memory to implement tailored digital signal processing, packet processing, or protocol handling blocks.
• Memory-Intensive Functions — Approximately 5.37 Mbits of on-chip RAM supports buffering, FIFOs, and on-chip data storage for latency-sensitive tasks.
• High-IO Connectivity — 252 I/Os enable complex peripheral interfacing, multi-lane interfaces, and flexible board-level integration.

Unique Advantages

• Balanced Logic and Memory — A combination of substantial logic density and multiple megabits of embedded RAM enables integrated implementation of both control and data paths.
• Compact, Production-Ready Package — 572-FBGA (25×25) in a surface-mount form factor simplifies PCB layout for space-constrained systems.
• Defined Power Envelope — Core supply range of 0.87–0.93 V allows precise power-supply planning and margining in system power design.
• Commercial Temperature Rating — Rated for 0 °C to 85 °C, suitable for standard commercial deployments.
• Environmentally Compliant — RoHS compliance supports environmental and regulatory requirements for many product lines.

Why Choose EP2AGX65DF25C4N?

The EP2AGX65DF25C4N delivers a strong blend of programmable logic density, on-chip RAM, and I/O resources in a compact 572-FBGA package. As part of the Intel Arria II GX family, it is suited to designs that require substantial custom logic, embedded memory, and flexible interfacing while adhering to commercial temperature and RoHS requirements.

This device is a practical choice for engineering teams building mid-to-high complexity digital systems that need integrated logic and memory capacity with a well-defined power and thermal operating window.

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