EP2AGX65DF25C5G

The EP2AGX65DF25C5G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572-ball FCBGA package. It provides a programmable logic fabric with significant on-chip memory and a high I/O count for designs that require configurable digital logic and memory integration.

Targeted for commercial-grade electronics, this device combines 60,214 logic elements with approximately 5.37 Mbits of embedded memory, a 252-pin I/O interface, and a compact surface-mount 572-BGA package to support a wide range of configurable digital designs within a 0 °C to 85 °C operating range.

Key Features

• Core Logic — Contains 60,214 logic elements (cells) to implement custom logic functions and state machines.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM for buffering, FIFOs, look-up tables, and other memory-intensive logic functions.
• I/O — 252 I/O pins to support dense external interfacing and multiple signal domains.
• Power Supply — Operates from a device supply range of 870 mV to 930 mV, enabling integration into low-voltage system designs.
• Package & Mounting — Supplied in a 572-BGA (572-FBGA, FC 25×25) surface-mount package for compact board-level integration.
• Operating Range & Grade — Commercial-grade device with an operating temperature range of 0 °C to 85 °C for standard electronics applications.
• RoHS Compliance — Meets RoHS requirements for lead-free assembly and regulatory compliance in many electronic products.

Typical Applications

• Embedded Systems — Use the programmable logic and on-chip memory to implement custom control, signal processing, and glue-logic functions within embedded products.
• I/O-Intensive Designs — The 252 I/O pins make this FPGA suitable for designs that require interfacing to multiple peripherals, sensors, or external buses.
• Prototype and Development Platforms — Commercial-grade temperature range and a compact BGA package suit rapid prototyping and evaluation of custom logic for product development.

Unique Advantages

• High Logic Capacity: 60,214 logic elements provide ample resources to implement complex state machines and custom datapaths without external ASICs.
• Substantial On‑Chip Memory: Approximately 5.37 Mbits of embedded RAM reduces dependence on external memory for buffering and real-time data handling.
• Dense I/O Integration: 252 I/O pins enable flexible partitioning of signals and direct connections to multiple external devices, lowering board-level complexity.
• Compact Surface-Mount Package: The 572-BGA (25×25) package supports space-efficient PCB layouts and high-density board integration.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for mainstream electronic products and assemblies.

Why Choose EP2AGX65DF25C5G?

The EP2AGX65DF25C5G Arria II GX FPGA balances substantial logic resources, embedded memory, and a high I/O count within a compact 572-BGA surface-mount package. Its specification set—60,214 logic elements, approximately 5.37 Mbits of on-chip RAM, 252 I/O pins, and a low-voltage supply range—makes it a practical choice for commercial electronic designs that require configurable logic, moderate memory capacity, and dense external interfacing.

Designed and manufactured by Intel, this device is suited for engineers and teams developing configurable digital systems, prototypes, and production products that operate within a standard commercial temperature range and require RoHS-compliant components.

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