EP2AGX65DF25C6

The EP2AGX65DF25C6 is an Arria II GX field-programmable gate array (FPGA) in a 572‑FBGA package (25×25). It delivers a programmable logic fabric and on-chip memory suitable for I/O‑intensive and custom logic implementations in commercial-grade designs.

Built around the Arria II GX device family architecture, this device provides a balance of logic density, embedded RAM, and a substantial I/O complement to support complex board-level functions where flexibility and integration are required.

Key Features

• Logic Resources — 60,214 logic elements and 2,530 logic array blocks provide programmable fabric for implementing custom logic and control functions.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM for buffering, packet processing, or local data storage.
• I/O Capacity — 252 user I/O pins enable extensive external interfacing and board-level connectivity.
• Package and Mounting — 572‑FBGA (FC) 25×25 package in an FCBGA footprint with surface-mount mounting for compact board designs.
• Power Supply — Core voltage supply specified at 870 mV to 930 mV for the device core and associated blocks.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density I/O bridging — Use the device’s 252 I/O pins to implement protocol bridging, board-level interfacing, and custom I/O logic.
• Custom logic and control — Leverage 60,214 logic elements and embedded RAM for control plane functions, datapath processing, and state machines.
• Embedded buffering and local storage — Approximately 5.37 Mbits of on-chip RAM supports packet buffering, FIFO implementations, and temporary data storage.

Unique Advantages

• Substantial programmable capacity: 60,214 logic elements provide the headroom to implement sizable custom logic blocks without external ASICs.
• Integrated memory for data‑centric tasks: Approximately 5.37 Mbits of embedded RAM reduces reliance on external memory for many buffering and state retention needs.
• High I/O count: 252 I/O pins support diverse interfacing requirements and simplify board-level routing for multi‑bus designs.
• Compact FCBGA footprint: The 572‑FBGA (25×25) package offers a dense, surface-mount solution for space-constrained PCBs.
• Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C and compliant with RoHS requirements for mainstream commercial deployments.

Why Choose EP2AGX65DF25C6?

The EP2AGX65DF25C6 Arria II GX FPGA combines a significant logic fabric, embedded memory, and a broad I/O complement in a compact 572‑FBGA package. Its core voltage range and documented device family characteristics make it a practical choice for commercial applications that require flexible, programmable hardware for protocol handling, control logic, and data buffering.

This device is well suited for design teams and procurement seeking a commercially graded FPGA with enough resources to offload custom functions from a microprocessor, consolidate discrete logic, or implement mid‑range datapath and control subsystems while maintaining a compact board footprint and RoHS compliance.

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