EP2AGX65DF25I3

The EP2AGX65DF25I3 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572‑ball FCBGA package. It provides mid‑to‑high logic capacity and embedded memory for custom hardware implementations and is offered in an industrial grade with extended temperature capability.

This device is suited to applications that require flexible programmable logic, substantial on‑chip RAM, and a high I/O count, while operating across a wide industrial temperature range and low core voltage window.

Key Features

• Logic Capacity  Approximately 60,214 logic elements providing substantial programmable fabric for custom logic, DSP, and control functions.
• Logic Blocks  2,530 logic blocks (as indicated in device data) to structure and partition designs within the FPGA fabric.
• Embedded Memory  Approximately 5.37 Mbits of on‑chip RAM for data buffering, FIFOs, and implemented memories.
• I/O Density  252 user I/O pins to support broad external interfacing and parallel connectivity.
• Package & Mounting  572‑FBGA (25×25) FCBGA package in a surface‑mount form factor for compact board integration.
• Core Voltage  Low‑voltage core operation with a supply range of 870 mV to 930 mV, suitable for modern power‑optimized system designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Industrial grade temperature rating and robust logic/memory resources enable motor control, PLC functions, and real‑time control logic in harsh environments.
• Communications & Networking  High I/O count and family‑level transceiver documentation support implementation of custom packet processing, protocol bridging, and interface adaptation.
• Embedded Acceleration  Large logic capacity and embedded RAM allow hardware acceleration for signal processing, custom compute kernels, and data buffering in compact systems.

Unique Advantages

• High programmable capacity: Approximately 60,214 logic elements give designers the resources to implement complex algorithms and sizable state machines on a single device.
• Substantial on‑chip memory: About 5.37 Mbits of embedded RAM reduce external memory dependency for mid‑range buffering and local storage.
• Broad I/O flexibility: 252 I/O pins enable multiple parallel interfaces and flexible board‑level partitioning without immediate need for external GPIO expanders.
• Compact board footprint: 572‑FBGA (25×25) package provides a high‑density mounting option for space‑constrained designs.
• Industrial operation: Specified −40 °C to 100 °C operating range supports deployments in temperature‑challenging installations.
• Low‑voltage core: Core supply range of 870 mV to 930 mV helps with power budget planning in energy‑sensitive applications.

Why Choose EP2AGX65DF25I3?

The EP2AGX65DF25I3 combines significant programmable logic and embedded memory with a high I/O count and industrial temperature capability, making it a practical choice for engineers building mid‑density FPGA solutions that must operate reliably across demanding environments. Its 572‑FBGA surface‑mount package balances density and board integration needs.

Backed by Intel’s Arria II GX device documentation, this industrial‑grade FPGA is positioned for applications where deterministic programmable logic, on‑chip RAM, and broad interfacing are required, offering a scalable platform for custom hardware implementations.

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