EP2AGX65DF25C6G

The EP2AGX65DF25C6G is a commercial-grade Arria II GX FPGA from Intel that integrates programmable logic and embedded memory in a compact FCBGA package. It delivers 60,214 logic elements and approximately 5.37 Mbits of on-chip RAM to support complex digital designs.

With 252 I/O connections, a core voltage supply range of 870 mV to 930 mV, surface-mount 572-BGA packaging (572-FBGA, FC 25×25), and an operating temperature range of 0 °C to 85 °C, this device is specified for standard commercial applications requiring substantial logic, memory, and I/O integration.

Key Features

• Programmable Logic Capacity – Integrates 60,214 logic elements to implement user-defined digital functions and control logic.
• Embedded Memory – Approximately 5.37 Mbits of on-chip RAM for data buffering, lookup tables, and state storage without immediate reliance on external memory.
• I/O Resources – Provides 252 I/O connections to interface with peripherals, sensors, and external bus systems.
• Power Supply – Core voltage specified from 870 mV to 930 mV for low-voltage operation.
• Package and Mounting – Surface-mount 572-BGA, FCBGA (supplier device package: 572-FBGA, FC 25×25) for compact board-level integration.
• Commercial Temperature Grade – Rated for operation from 0 °C to 85 °C and designated as Commercial grade.

Typical Applications

• Programmable logic implementations – Custom digital designs requiring configurable logic resources and embedded memory.
• I/O-intensive interfacing – Systems that need a large number of external connections for sensors, transceivers, or peripheral devices.
• On-chip data buffering – Temporary data storage and staging using approximately 5.37 Mbits of embedded RAM.
• Prototyping and development – Commercial-grade FPGA capacity for evaluation boards and proof-of-concept designs.

Unique Advantages

• High logic density: 60,214 logic elements enable consolidation of complex functions onto a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 5.37 Mbits of on-chip RAM helps minimize external memory requirements and simplifies memory architecture.
• Ample I/O capacity: 252 I/O connections reduce the need for external multiplexing and support diverse interfacing needs.
• Compact surface-mount package: 572-FBGA (25×25) allows integration into space-constrained PCBs while retaining robust solderable connections.
• Low-voltage core operation: 870–930 mV supply range supports low-voltage design practices and power optimization at the core level.
• Commercial operating range: Specified 0 °C to 85 °C operation aligns with standard commercial deployment environments.

Why Choose EP2AGX65DF25C6G?

The EP2AGX65DF25C6G positions itself as a commercial-grade, mid-to-high density FPGA option from Intel that combines significant logic capacity, on-chip RAM, and broad I/O capability in a compact BGA package. Its specification set supports designs that require consolidated programmable logic, embedded buffering, and multiple external interfaces within a standard commercial temperature range.

Design teams and procurement professionals seeking a vendor-backed FPGA offering balanced logic resources, embedded memory, and a compact surface-mount footprint will find the EP2AGX65DF25C6G suitable for applications where integration, board space, and I/O count are key considerations.

Request a quote or submit an inquiry for pricing and availability of the EP2AGX65DF25C6G to evaluate suitability for your next design.