EP2AGX65DF25I3N

The EP2AGX65DF25I3N is an Intel Arria II GX field programmable gate array supplied in a 572-ball FCBGA package. It provides a large programmable fabric with on-chip embedded memory and a substantial I/O count, intended for designs that require customizable logic, embedded RAM, and broad connectivity in industrial temperature environments.

As part of the Arria II family, device documentation highlights electrical and switching characteristics including transceiver performance and periphery timing, enabling integration into systems that require configurable high-speed interfaces and programmable I/O timing.

Key Features

• Logic Capacity  Provides 60,214 logic elements for flexible, large-scale programmable logic implementations.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM to support buffering, frame storage, and local data processing.
• I/O Count  252 user I/O pins to support wide peripheral connectivity and parallel interfaces.
• Package & Mounting  572-ball FCBGA (572-FBGA, FC 25×25) package; surface-mount mounting type for compact board-level integration.
• Power  Core voltage supply specified at 870 mV to 930 mV for device operation.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C.
• Transceiver & I/O Capabilities  Datasheet references Arria II GX transceiver performance and programmable I/O timing, supporting high-speed serial interfaces and configurable I/O buffering.
• Environmental Compliance  RoHS compliant for global electronics manufacturing requirements.

Typical Applications

• High-speed communication interfaces  Leverages Arria II GX transceiver capabilities and 252 I/Os for protocol bridging and backplane or board-to-board links.
• Embedded system control and prototyping  60,214 logic elements and ~5.37 Mbits of embedded RAM accommodate custom control logic, state machines, and interface glue logic during development and deployment.
• Industrial instrumentation and equipment  Industrial temperature rating (-40 °C to 100 °C) and RoHS compliance support use in robust, regulated environments.
• Data buffering and preprocessing  On-chip RAM and programmable fabric enable local data buffering and real-time preprocessing ahead of host processing.

Unique Advantages

• Substantial programmable capacity: 60,214 logic elements allow complex custom logic without external ASIC development.
• Significant embedded memory: Approximately 5.37 Mbits of on-chip RAM reduces external memory dependency for many buffering and local storage needs.
• Extensive I/O connectivity: 252 I/O pins provide flexibility for interfacing to a wide range of peripherals and parallel buses.
• Industrial operating range: Rated from -40 °C to 100 °C for deployment in harsh or temperature-variable environments.
• Compact BGA package: 572-FBGA (25×25) packaging enables high-density board layouts with surface-mount mounting.
• Standards-aware device documentation: Arria II device handbook details electrical, switching, and transceiver characteristics to support system integration and timing analysis.

Why Choose EP2AGX65DF25I3N?

The EP2AGX65DF25I3N positions itself as a robust, industrial-grade programmable logic device with a large logic fabric, meaningful on-chip RAM, and a high I/O count in a compact 572-FBGA package. Its specified core voltage range and documented Arria II GX electrical and transceiver characteristics make it suitable for designs that require configurable high-speed interfaces, local data handling, and reliable operation across extended temperature ranges.

This device is well suited for engineering teams and procurement sourcing FPGAs for industrial systems, communications front-ends, or high-density board designs that benefit from substantial programmable resources combined with on-chip memory and extensive I/O.

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