EP2AGX65DF25I5N

The EP2AGX65DF25I5N is an Arria II GX field programmable gate array (FPGA) in a 572‑FBGA surface‑mount package. It provides a programmable logic fabric with 60,214 logic elements and embedded on‑chip memory, aimed at designs that require substantial logic capacity and on‑board memory in an industrial‑grade device.

With 252 general I/O pins, a core supply window of 0.870–0.930 V, and an industrial operating temperature range of −40 °C to 100 °C, this device targets applications that need a combination of high logic density, significant embedded memory, and extended temperature operation.

Key Features

• Logic Capacity 60,214 logic elements (cells) to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 5.37 Mbits of on‑chip RAM for buffering, packet storage, and on‑chip data structures.
• I/O Density 252 I/O pins to support diverse peripheral interfaces and board‑level connectivity.
• Power and Core Voltage Core supply range from 0.870 V to 0.930 V to support the device’s operating conditions and power domains.
• Package and Mounting 572‑FBGA (25 × 25 mm) ball grid array, surface‑mount package for compact board integration.
• Industrial Grade and Temperature Range Rated for industrial operation with an ambient operating range of −40 °C to 100 °C.
• RoHS Compliant Conforms to RoHS requirements for lead‑free manufacturing and end‑product compliance.

Unique Advantages

• High logic integration: 60,214 logic elements provide ample capacity for mid‑to‑large FPGA designs without external glue logic.
• Substantial on‑chip memory: Approximately 5.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Ample I/O count: 252 I/O pins enable multiple parallel interfaces and flexible board routing options.
• Industrial reliability: Specified for −40 °C to 100 °C operation, suitable for equipment operating across wide temperature ranges.
• Compact BGA footprint: 572‑FBGA (25 × 25) surface‑mount package supports dense PCB layouts while maintaining thermal and mechanical robustness.
• Controlled core voltage: Narrow core supply window (0.870–0.930 V) supports predictable power budgeting and integration with system power supplies.

Why Choose EP2AGX65DF25I5N?

The EP2AGX65DF25I5N Arria II GX FPGA combines a high logic element count, significant embedded RAM, and a substantial I/O complement in a compact 572‑FBGA package rated for industrial temperatures. These characteristics make it well suited for designs that require integrated programmable logic and memory in environments where temperature resilience and board‑level density are important.

Engineers looking for a robust, RoHS‑compliant FPGA option with defined core power requirements and a high I/O count can evaluate this part for mid‑to‑high complexity applications where on‑chip memory and logic capacity reduce external components and simplify system architecture.

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