EP2AGX65DF29C4G

The EP2AGX65DF29C4G is an Arria II GX field-programmable gate array (FPGA) IC from Intel, supplied in a 780-ball FCBGA package. It provides a balance of programmable logic capacity, embedded memory, and a high count of user I/O for commercial electronic designs.

With 60,214 logic elements, approximately 5.37 Mbits of on-chip RAM and 364 user I/O, this device targets designs that require dense logic implementation, embedded buffering, and substantial I/O integration within a surface-mount BGA footprint.

Key Features

• Logic Capacity 60,214 logic elements (LEs) for implementing custom digital logic and control functions.
• Embedded Memory Approximately 5.37 Mbits of on-chip RAM to support buffering, state storage, and local data operations.
• I/O Count 364 user I/O pins to support multiple parallel interfaces and external device connectivity.
• Package & Mounting 780-BBGA (780-FBGA, 29×29) FCBGA package, designed for surface-mount PCB assembly.
• Power Voltage supply range of 870 mV to 930 mV to match system power-rail requirements.
• Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance RoHS compliant for materials and manufacturing practices.

Typical Applications

• Custom digital logic and prototyping — Use the device’s 60,214 logic elements to implement and iterate on complex digital designs and control logic.
• Embedded memory buffering — Approximately 5.37 Mbits of on-chip RAM supports local data storage, FIFOs and temporary buffering for data-path operations.
• I/O-rich interface implementations — 364 user I/O enable multiple parallel interfaces, sensor aggregation, and gateway-style connectivity within a single device.
• Compact, surface-mount systems — The 780-FBGA (29×29) package provides a high-density solution for space-constrained PCBs requiring a BGA footprint.

Unique Advantages

• High logic density: 60,214 logic elements allow substantial on-chip integration of custom logic, reducing the need for multiple discrete CPLDs or microcontrollers.
• Significant on-chip memory: Approximately 5.37 Mbits of embedded RAM reduces external memory dependency for many buffering and storage tasks.
• Extensive I/O availability: 364 user I/O pins support diverse interface mixes and simplify board-level routing for multi-channel designs.
• BGA package for compact designs: The 780-FBGA (29×29) package enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Defined commercial operating range: Rated for 0 °C to 85 °C to match common commercial electronic product requirements.
• RoHS compliant: Conforms to RoHS material requirements for environmental and regulatory considerations.

Why Choose EP2AGX65DF29C4G?

The EP2AGX65DF29C4G delivers a practical combination of logic capacity, embedded memory, and extensive I/O in a compact FCBGA package, making it well suited for commercial designs that require flexible, on-board programmable logic. Its power and temperature specifications provide clear system integration parameters for engineering and procurement teams.

This FPGA fits designs where consolidating digital functions, handling local data buffering, and supporting multiple external interfaces are priorities—providing a single-device option that simplifies BOM and board real estate while meeting RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability for the EP2AGX65DF29C4G and discuss how it can fit your next FPGA-based design.