EP2AGX65DF29C5N

The EP2AGX65DF29C5N is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package (780-BBGA, 29×29). It provides a combination of dense logic resources, on‑chip memory, and a large I/O count for complex system integration.

This device targets designs that require substantial programmable logic and embedded RAM: it offers 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and up to 364 I/Os, all in a surface-mount FCBGA package rated for commercial operating temperatures.

Key Features

• Core logic  60,214 logic elements (cells) for implementing complex digital functions and custom hardware acceleration.
• Embedded memory  Approximately 5.37 Mbits of on-chip RAM to support buffering, packet storage, and embedded data structures without immediate dependence on external memory.
• I/O resources  Up to 364 I/Os to support multi-channel interfacing and flexible board-level connectivity.
• Package & mounting  780-BBGA (FCBGA) package in a 29×29 ball array, designed for surface-mount assembly to fit compact PCB layouts.
• Power  Core supply operating range specified from 870 mV to 930 mV, enabling designers to plan power distribution and supply sequencing.
• Thermal and grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards compliance  RoHS compliant for regulatory and environmental conformity.
• Family-level documentation  Arria II device handbook and datasheet coverage includes electrical and switching characteristics, transceiver and I/O timing information for Arria II GX devices.

Typical Applications

• High-density logic processing  Use the device’s 60,214 logic elements to implement complex state machines, data-paths, and custom accelerators.
• Embedded buffering and packet handling  Approximately 5.37 Mbits of on-chip RAM supports buffering and temporary storage for streaming or packetized data flows.
• Multi-channel interfacing  Up to 364 I/Os provide capacity for wide parallel interfaces, multiple serial channels, or mixed-signal front-end control.
• Compact system integration  The 780-BBGA FCBGA package supports dense PCB layout where high pin-count and small footprint are required.

Unique Advantages

• Highly integrated logic and memory: 60,214 logic elements combined with approximately 5.37 Mbits of embedded RAM reduces the need for some external components and simplifies board-level architecture.
• Generous I/O density: 364 I/Os enable flexible interfacing and the consolidation of multiple peripheral channels onto a single device.
• Compact package footprint: 780-ball FCBGA (29×29) supports high pin count in a space-efficient form factor suitable for dense systems.
• Commercial operating range: Rated for 0 °C to 85 °C, appropriate for standard commercial electronics deployments.
• Regulatory compliance: RoHS compliant for easier integration into environmentally regulated product lines.

Why Choose EP2AGX65DF29C5N?

The EP2AGX65DF29C5N combines a substantial logic fabric, on‑chip memory, and broad I/O capacity in a compact 780-BBGA FCBGA package, making it suitable for designs that demand high integration and flexible interfacing within commercial temperature environments. As part of the Arria II GX family, device-level documentation addresses electrical characteristics and I/O timing to aid system design and validation.

This device is well suited for engineering teams seeking to implement dense programmable logic, embedded data buffering, and multi-channel I/O in a single FPGA package while maintaining RoHS compliance and commercial-grade thermal limits.

Request a quote or submit your RFQ to evaluate EP2AGX65DF29C5N for your next design and receive pricing and availability information.