EP2AGX65DF29I3G

The EP2AGX65DF29I3G is an Intel Arria II GX family field programmable gate array (FPGA) supplied in a 780-ball BGA FCBGA package. It combines reconfigurable logic, embedded memory, and a broad I/O complement to address industrial designs that require on-chip programmable resources.

With 60,214 logic elements, approximately 5.37 Mbits of embedded memory and 364 user I/Os, this device delivers a balanced mix of logic density, on-chip RAM and I/O capacity in a compact 29 × 29 780-FBGA footprint, while supporting industrial operating temperatures and RoHS compliance.

Key Features

• Core Logic  60,214 logic elements provide the reconfigurable fabric for implementing complex digital systems and custom logic blocks.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM supports buffering, FIFOs and local data storage without external memory.
• I/O Capacity  364 user I/Os enable broad signal interfacing for peripherals, sensors, transceivers and board-level connectivity.
• Power Supply Range  Operates with a core voltage supply between 870 mV and 930 mV to meet board power design requirements.
• Package & Mounting  780-BBGA (FCBGA) package, supplier device package 780-FBGA (29 × 29), designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Compliance  RoHS compliant material status supports lead-free assembly and regulatory requirements.

Typical Applications

• Embedded Systems  Implement custom control and data-path logic using 60,214 logic elements and integrated RAM for local buffering.
• High-Density I/O Processing  Leverage 364 user I/Os to interface with sensors, ADCs/DACs, or parallel/serial peripherals on complex boards.
• Prototyping and Custom IP Integration  Use the reconfigurable fabric and on-chip memory to validate algorithms and integrate proprietary IP.
• Industrial Controls  Deploy in equipment that requires extended temperature operation and surface-mount BGA packaging for compact board designs.

Unique Advantages

• Well-balanced integration: Combines 60,214 logic elements with approximately 5.37 Mbits of embedded memory to reduce dependency on external components.
• Ample I/O availability: 364 user I/Os provide flexibility for complex interfacing and mixed-signal board layouts.
• Industrial readiness: Specified operation from −40 °C to 100 °C supports deployments in demanding temperature environments.
• Compact BGA package: 780-BBGA (29 × 29) FCBGA package allows high-density PCB implementation with surface-mount assembly.
• RoHS compliance: Material compliance simplifies lead-free manufacturing and environmental conformity.

Why Choose EP2AGX65DF29I3G?

The EP2AGX65DF29I3G positions itself as a versatile Arria II GX FPGA option for engineers who need a combination of significant programmable logic, on-chip memory and a high I/O count in a compact FCBGA package. Its industrial temperature rating and RoHS-compliant construction make it suitable for production systems that demand reliability across a wide thermal range.

This device is well suited to teams building embedded systems, board-level signal processing, or custom logic implementations that benefit from integrated memory and plentiful I/O while maintaining a compact, surface-mount form factor.

Request a quote or submit an inquiry to receive pricing and availability for the EP2AGX65DF29I3G and to discuss supply options for your next design.