EP2AGX65DF29I5

The EP2AGX65DF29I5 is an Arria II GX field-programmable gate array (FPGA) from Intel, delivered in a 780-BBGA FCBGA surface-mount package. It provides a mid-to-high density programmable-logic resource set suitable for industrial applications requiring extended temperature operation and a high I/O count.

As part of the Arria II GX device family, this device includes the electrical and transceiver building blocks described in the device handbook, enabling designs that require programmable logic, embedded RAM, and high pin-count connectivity within a compact FCBGA package.

Key Features

• Logic Capacity  Approximately 60,214 logic elements delivering substantial configurable logic for glue-logic, control, and compute tasks.
• Logic-array Blocks  2,530 logic-array blocks for organized logic clustering and hierarchical design partitioning.
• Embedded Memory  Approximately 5.37 Mbits of on-chip RAM for buffering, FIFOs, and small working sets.
• I/O Density  364 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Transceiver and PCIe Support (Family)  Arria II GX family documentation details transceiver performance and PCI Express (PIPE) HIP block capabilities for high-speed serial connectivity and protocol interfacing.
• Power Supply  Core voltage supply specified between 870 mV and 930 mV to meet Arria II GX electrical requirements.
• Package and Mounting  780-BBGA FCBGA package (supplier package: 780-FBGA, 29×29) in a surface-mount form factor for compact board integration.
• Industrial Grade and Temperature Range  Rated industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation  Industrial-grade operation and extended temperature range support reliable deployment in factory and process-control systems.
• High‑Pin‑Count Interface Implementations  A high I/O count and on-chip memory enable interface bridging, protocol conversion, and parallel data-handling tasks.
• Serial Connectivity and Protocol Offload  Arria II GX family transceiver and PCIe HIP block capabilities suit designs that integrate high-speed serial links or PCI Express endpoints as described in the device documentation.

Unique Advantages

• Substantial Logic Resources: Approximately 60,214 logic elements and 2,530 logic-array blocks provide the capacity to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory On‑Chip: Roughly 5.37 Mbits of RAM reduces external memory dependency for many buffering and small-data storage needs, simplifying board-level BOM.
• High I/O Count: 364 I/O pins enable wide parallel connections and flexible partitioning of signals across multiple banks.
• Industrial Temperature Range: Rated from −40°C to 100°C, making the device suitable for harsher environmental conditions common in industrial deployments.
• Compact FCBGA Package: 780-ball FCBGA (29×29) provides a space-efficient footprint for high-density system designs.
• Standards‑oriented Family Features: Arria II GX family documentation includes transceiver and PCIe infrastructure details that support high-speed protocols and system-level integration.

Why Choose EP2AGX65DF29I5?

The EP2AGX65DF29I5 brings together substantial programmable logic, multi-megabit on-chip memory, and a high I/O count in a compact FCBGA package rated for industrial use. It is suited to engineers designing robust embedded systems that require flexible logic implementation, significant local memory, and numerous external interfaces within an industrial temperature envelope.

Backed by the Arria II GX device family documentation and Intel manufacturing, this device is appropriate for teams seeking a scalable FPGA resource with documented electrical and transceiver characteristics for integration into longer-lived, fielded systems.

If you would like pricing, availability, or a technical quotation for EP2AGX65DF29I5, request a quote or submit an inquiry and our team will respond with the next steps.