EP2AGX65DF29I3N

The EP2AGX65DF29I3N is an Arria II GX family Field Programmable Gate Array (FPGA) designed for applications that require reconfigurable logic, substantial on‑chip memory, and a high I/O count. Packaged in a 780‑ball FCBGA (29×29) surface‑mount package and offered in an industrial temperature grade, it provides a balance of integration and ruggedness for demanding embedded and system integration designs.

Key architectural characteristics include 60,214 logic elements and approximately 5.37 Mbits of embedded memory, enabling complex custom logic and buffering on a single device while supporting up to 364 I/O connections.

Key Features

• Logic Density  60,214 logic elements to implement complex custom logic functions and parallel datapaths.
• Embedded Memory  Approximately 5.37 Mbits of on‑chip RAM for frame buffering, state storage, and small embedded data structures.
• I/O Capacity  364 user I/O pins to support multiple interfaces, parallel buses, and high pin‑count designs.
• Package & Mounting  780‑BBGA (FCBGA) package, supplier device package 780‑FBGA (29×29), surface‑mount for compact, high‑density board layouts.
• Power Supply  Core voltage supply range of 870 mV to 930 mV for compatible power‑rail design and power sequencing.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Compliance  RoHS compliant, supporting lead‑free assembly and environmental regulatory requirements.
• Family Documentation  Part of the Arria II GX device family; the device handbook provides detailed electrical and transceiver performance specifications and operating conditions for system design and verification.

Typical Applications

• Industrial Control and Automation  Reconfigurable logic and industrial temperature rating enable deployment in factory automation, motion control, and PLC systems.
• Communications and Networking  High I/O count and on‑chip memory support protocol bridging, packet buffering, and custom interface logic in network equipment.
• Embedded System Integration  Used as a compact, programmable glue‑logic and DUT controller in instrumentation, test equipment, and prototype platforms.

Unique Advantages

• Substantial Logic Resources  60,214 logic elements simplify implementation of large custom state machines, datapaths, and parallel accelerators on a single device.
• Integrated On‑Chip Memory  Approximately 5.37 Mbits of embedded RAM reduces external memory dependency for buffering and local storage, lowering BOM and board complexity.
• High Pin Count in Compact Package  364 I/Os in a 780‑ball FCBGA package enable dense I/O routing while maintaining a small board footprint.
• Industrial Temperature Rating  Operation from −40 °C to 100 °C provides thermal margin for industrial and harsh‑environment applications.
• RoHS Compliance  Supports lead‑free manufacturing processes and environmental compliance requirements.

Why Choose EP2AGX65DF29I3N?

The EP2AGX65DF29I3N delivers a balanced combination of logic capacity, embedded memory, and high I/O count in an industrial‑rated Arria II GX FPGA. Its core voltage range and robust packaging make it suitable for designs that demand reconfigurable hardware, compact board integration, and reliable operation across extended temperature ranges.

This device is well suited for engineers and system designers building industrial control, communications, and embedded integration platforms who require a proven FPGA family with thorough device handbook documentation for electrical and transceiver characteristics.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical documentation for EP2AGX65DF29I3N.