EP2AGX65DF29I5N

The EP2AGX65DF29I5N is an Intel Arria II GX field-programmable gate array (FPGA) in a 780‑FBGA (29×29) FCBGA package. It provides a substantial programmable fabric with 60,214 logic elements, approximately 5.37 Mbits of embedded memory, and 364 user I/O pins.

Specified as an industrial-grade surface-mount device with an operating temperature range of -40 °C to 100 °C and a core supply range of 870 mV to 930 mV, this FPGA is intended for designs that require significant on-chip logic, memory, and I/O integration in a compact BGA footprint.

Key Features

• Programmable Logic Capacity — 60,214 logic elements provide a large amount of user-configurable logic for complex digital designs.
• Embedded Memory — Approximately 5.37 Mbits of on-chip RAM to support buffers, FIFOs, and state storage without external memory for many functions.
• I/O Count — 364 I/O pins to interface with peripherals, memory, and board-level signals.
• Package and Mounting — 780‑FBGA (29×29) FCBGA / 780‑BBGA package in a surface-mount form factor for high-density board designs.
• Power — Core voltage supply specified from 870 mV to 930 mV to match system power design requirements.
• Temperature and Grade — Industrial grade with an operating range of -40 °C to 100 °C for elevated environmental tolerance.
• Standards Compliance — RoHS compliant.

Unique Advantages

• High on-chip integration: Combines a large logic fabric and multi-megabit embedded RAM to reduce reliance on external components.
• Extensive I/O: 364 I/O pins offer flexibility for interfacing multiple subsystems or parallel buses without complex multiplexing.
• Industrial temperature capability: Rated for -40 °C to 100 °C operation to support designs exposed to a wide thermal range.
• Compact BGA footprint: 780‑FBGA (29×29) package enables dense board layouts while maintaining substantial device resources.
• Tightly specified core supply: 870 mV–930 mV range helps designers plan power delivery and thermal budgets accurately.
• Regulatory compliance: RoHS status simplifies regulatory documentation and selection for assemblies requiring lead-free components.

Why Choose EP2AGX65DF29I5N?

The EP2AGX65DF29I5N positions itself as a high-capacity Arria II GX FPGA option for designs that need large programmable logic density, significant embedded memory, and abundant I/O in a single, industrial-grade package. Its BGA footprint and surface-mount mounting simplify integration into compact, high-density PCBs.

Use this device when your design requires a balance of logic capacity, on-chip RAM, and robust environmental specifications. The explicit electrical and mechanical parameters—logic elements, memory size, I/O count, supply voltage window, package type, and operating temperature—allow precise system-level planning and component selection.

Request a quote or submit a purchase inquiry for EP2AGX65DF29I5N today to receive pricing and availability information tailored to your volume and lead-time needs.