EP2AGX95DF25C4
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA |
|---|---|
| Quantity | 552 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 572-FBGA, FC (25x25) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 572-BGA, FCBGA | Number of I/O | 260 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2530 | Number of Logic Elements/Cells | 89178 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6839296 |
Overview of EP2AGX95DF25C4 – Arria II GX FPGA, 572-FBGA, 260 I/Os
The EP2AGX95DF25C4 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572-ball FCBGA package. It delivers a large programmable fabric with substantial embedded memory and a high I/O count suitable for complex logic integration in commercial applications.
This commercial-grade device is supplied as a surface-mount IC and is designed within the Arria II GX device family, which the datasheet identifies as including transceiver and PCI Express (PIPE) HIP functionality and detailed I/O timing controls.
Key Features
- Logic Capacity Approximately 89,178 logic elements for implementing complex programmable logic and custom functions.
- Embedded Memory Approximately 6.84 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
- I/O Density 260 I/O pins providing high interface density for peripherals, memory, and high-speed links.
- Transceiver and Interface Support Arria II GX family devices include transceiver performance specifications and PCI Express (PIPE) HIP block support as described in the device handbook.
- Power and Core Supply Core supply operating range of 870 mV to 930 mV, with electrical characteristics and absolute maximum ratings documented in the device handbook.
- Package and Mounting 572-ball FCBGA (25×25) package, surface-mount mounting type suitable for standard PCB assembly processes.
- Operating Range Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- High-speed communications Leveraging the Arria II GX transceiver and PCI Express (PIPE) HIP block capabilities for protocol and link implementations.
- Embedded computing and acceleration Large logic element count and on-chip RAM enable custom processing, offload, and control tasks.
- Interface bridging and protocol conversion High I/O count and programmable I/O timing facilitate multi-protocol interfacing and signal conditioning.
Unique Advantages
- Substantial logic resources: Approximately 89,178 logic elements allow implementation of sizable custom logic blocks and state machines.
- Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- High interface density: 260 I/Os provide flexibility for connecting multiple peripherals, buses, and external devices without extensive external glue logic.
- Documented transceiver and PCIe support: Arria II GX device handbook details transceiver performance and PCI Express (PIPE) HIP block functionality to guide high-speed design.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
- Standard surface-mount FCBGA package: 572-ball 25×25 FCBGA simplifies board-level integration and supports established assembly processes.
Why Choose EP2AGX95DF25C4?
The EP2AGX95DF25C4 positions itself as a high-capacity, commercially rated Arria II GX FPGA that balances large programmable logic resources, significant embedded RAM, and a high number of I/Os in a 572-ball FCBGA package. Its documented transceiver and PCI Express (PIPE) HIP capabilities, together with detailed electrical characteristics in the device handbook, make it suitable for designs that require substantial on-chip logic, memory, and interface bandwidth within commercial temperature envelopes.
Engineers and procurement teams seeking a commercially graded Arria II GX device with clear electrical and package specifications will find this part suitable for complex system integration where programmable logic, embedded memory, and interface density are primary requirements.
If you would like pricing, availability, or a formal quotation for EP2AGX95DF25C4, please submit a request for a quote including your required quantity and delivery timeframe.

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