EP2AGX95DF25C4

IC FPGA 260 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA

Quantity 552 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O260Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells89178
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95DF25C4 – Arria II GX FPGA, 572-FBGA, 260 I/Os

The EP2AGX95DF25C4 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572-ball FCBGA package. It delivers a large programmable fabric with substantial embedded memory and a high I/O count suitable for complex logic integration in commercial applications.

This commercial-grade device is supplied as a surface-mount IC and is designed within the Arria II GX device family, which the datasheet identifies as including transceiver and PCI Express (PIPE) HIP functionality and detailed I/O timing controls.

Key Features

  • Logic Capacity  Approximately 89,178 logic elements for implementing complex programmable logic and custom functions.
  • Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
  • I/O Density  260 I/O pins providing high interface density for peripherals, memory, and high-speed links.
  • Transceiver and Interface Support  Arria II GX family devices include transceiver performance specifications and PCI Express (PIPE) HIP block support as described in the device handbook.
  • Power and Core Supply  Core supply operating range of 870 mV to 930 mV, with electrical characteristics and absolute maximum ratings documented in the device handbook.
  • Package and Mounting  572-ball FCBGA (25×25) package, surface-mount mounting type suitable for standard PCB assembly processes.
  • Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

  • High-speed communications  Leveraging the Arria II GX transceiver and PCI Express (PIPE) HIP block capabilities for protocol and link implementations.
  • Embedded computing and acceleration  Large logic element count and on-chip RAM enable custom processing, offload, and control tasks.
  • Interface bridging and protocol conversion  High I/O count and programmable I/O timing facilitate multi-protocol interfacing and signal conditioning.

Unique Advantages

  • Substantial logic resources: Approximately 89,178 logic elements allow implementation of sizable custom logic blocks and state machines.
  • Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • High interface density: 260 I/Os provide flexibility for connecting multiple peripherals, buses, and external devices without extensive external glue logic.
  • Documented transceiver and PCIe support: Arria II GX device handbook details transceiver performance and PCI Express (PIPE) HIP block functionality to guide high-speed design.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
  • Standard surface-mount FCBGA package: 572-ball 25×25 FCBGA simplifies board-level integration and supports established assembly processes.

Why Choose EP2AGX95DF25C4?

The EP2AGX95DF25C4 positions itself as a high-capacity, commercially rated Arria II GX FPGA that balances large programmable logic resources, significant embedded RAM, and a high number of I/Os in a 572-ball FCBGA package. Its documented transceiver and PCI Express (PIPE) HIP capabilities, together with detailed electrical characteristics in the device handbook, make it suitable for designs that require substantial on-chip logic, memory, and interface bandwidth within commercial temperature envelopes.

Engineers and procurement teams seeking a commercially graded Arria II GX device with clear electrical and package specifications will find this part suitable for complex system integration where programmable logic, embedded memory, and interface density are primary requirements.

If you would like pricing, availability, or a formal quotation for EP2AGX95DF25C4, please submit a request for a quote including your required quantity and delivery timeframe.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up