EP2AGX65DM17I6N

The EP2AGX65DM17I6N is an Intel Arria II GX Field Programmable Gate Array (FPGA) offered in a surface-mount package and specified for industrial use. It provides reconfigurable logic resources with 60,214 logic elements and approximately 5.37 Mbits of embedded memory, combined with 156 I/O pins and an industrial operating temperature range.

Designed for board-level integration, this device operates from a core supply range of 870 mV to 930 mV and is RoHS compliant, delivering a balance of on-chip memory, I/O capacity, and logic density suitable for designs that require reliable operation across extended temperatures.

Key Features

• Core Logic 60,214 logic elements provide a substantial amount of reconfigurable fabric for custom digital logic and control functions.
• Embedded Memory Approximately 5.37 Mbits of on-chip RAM to support buffering, lookup tables, and state storage close to logic resources.
• I/O Capacity 156 general-purpose I/O pins for interfacing with external devices, peripherals, and board-level signals.
• Power Range Core voltage supply specified from 870 mV to 930 mV, enabling designs that target the device's required low-voltage domain.
• Package & Mounting Surface-mount device suitable for automated PCB assembly and standard board-level integration workflows.
• Operating Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployments in extended-temperature environments.
• Environmental Compliance RoHS compliant to meet common hazardous substance regulations for electronic assemblies.

Unique Advantages

• High logic density: 60,214 logic elements deliver ample programmable resources to implement complex custom logic and control algorithms.
• Substantial on-chip memory: Approximately 5.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and lookup tasks.
• Generous I/O count: 156 I/O pins simplify system integration by providing broad connectivity options without immediate need for external expanders.
• Industrial temperature capability: Specified −40 °C to 100 °C operation supports use in environments with wide temperature variation.
• Surface-mount packaging: Enables standard PCB assembly and reflow processes for compact, production-ready designs.
• Low-voltage core operation: 870 mV–930 mV supply specification aligns with modern low-voltage power domains.

Why Choose EP2AGX65DM17I6N?

The EP2AGX65DM17I6N positions itself as a robust, industrial-grade FPGA option that combines a high count of logic elements, significant embedded memory, and broad I/O in a surface-mount form factor. These characteristics make it suitable for designs that need on-chip resources for custom digital processing while maintaining rugged operation across a wide temperature range.

For engineering teams seeking a reconfigurable device with measurable on-chip capacity—60,214 logic elements, approximately 5.37 Mbits of RAM, and 156 I/O—this FPGA provides the core building blocks to implement complex logic, local buffering, and extensive board-level interfacing in industrial applications.

Request a quote or submit an inquiry to receive pricing, availability, and procurement details for EP2AGX65DM17I6N.