EP2AGX65DF29I5G

IC FPGA 364 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 364 5371904 60214 780-BBGA, FCBGA

Quantity 628 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O364Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2530Number of Logic Elements/Cells60214
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5371904

Overview of EP2AGX65DF29I5G – Arria II GX FPGA, 780-FBGA (29×29), Industrial

The EP2AGX65DF29I5G is an Intel Arria II GX field-programmable gate array supplied in a 780-FBGA (29×29) surface-mount package and specified for industrial use. It combines a 40‑nm, low-power programmable logic architecture with plentiful on-chip resources — 60,214 logic elements and approximately 5.37 Mbits of embedded memory — to address high-bandwidth, interface-centric designs.

This device is targeted at applications that require integrated transceivers, flexible I/O and DSP capabilities. With 364 I/Os, support for transceiver-based serial protocols in the Arria II family, and a wide operating voltage and temperature range, it is suited for demanding system integration and performance-oriented deployments.

Key Features

  • Programmable Logic Core 60,214 logic elements provide the primary programmable fabric for custom logic, state machines, and glue logic.
  • Embedded Memory Approximately 5.37 Mbits of on‑chip RAM for FIFOs, buffers and intermediate data storage.
  • I/O and Package 364 user I/O pins in a 780‑BBGA (FCBGA) package; surface-mount footprint simplifies board-level integration.
  • Transceiver and Interface Support (Device Family) Arria II GX architecture supports multi-gigabit transceivers and common serial protocols (family-level capability described in the device handbook), enabling implementations of interfaces such as PCIe, Ethernet, DDR3 and SDI where required by system design.
  • DSP and Numeric Support Family-level DSP blocks and configurable multiplier options support hardware acceleration for signal processing (refer to device handbook for specific DSP block configurations and performance).
  • Power and Voltage Core voltage supply specified between 870 mV and 930 mV to match system power delivery requirements.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C suitable for industrial environments.
  • Security and Configuration (Family Capabilities) The Arria II family includes design security features such as AES programming file encryption and multiple configuration options (refer to the device handbook for details).

Typical Applications

  • High‑speed Communications Ideal for implementing protocol handling and physical-layer functions where Arria II family transceiver capabilities are required.
  • Network and Infrastructure Use for packet processing, aggregation, and interface bridging leveraging the device’s logic, I/O density, and embedded memory.
  • Video and SDI Processing Suitable for serial digital interface (SDI) and video transport endpoints that need deterministic data paths and DSP acceleration.
  • Storage and Connectivity Applicable to host or appliance designs requiring custom logic for interfaces such as SATA, SAS or Fibre Channel as supported by the Arria II family architecture.

Unique Advantages

  • High Logic Capacity: 60,214 logic elements enable complex control, protocol, and data‑path implementations without immediate need for external logic.
  • Integrated Memory Resources: Approximately 5.37 Mbits of embedded RAM reduce external memory dependency for many buffering and FIFO needs.
  • Industrial‑Grade Qualification: Specified for −40 °C to 100 °C operation, supporting temperature demands of industrial deployments.
  • Compact, Assembly‑Friendly Package: 780‑FBGA (29×29) surface-mount package provides a high‑density integration option for space‑constrained PCBs.
  • Family Documentation and IP Ecosystem: Backed by Arria II device handbook content that details interfaces, transceiver capabilities and IP options to accelerate system integration.
  • Controlled Core Supply Range: Defined core voltage range (870 mV–930 mV) supports predictable power design and supply sequencing.

Why Choose EP2AGX65DF29I5G?

The EP2AGX65DF29I5G provides a balanced combination of programmable logic capacity, embedded memory, and I/O count in a proven Arria II GX family architecture. Its industrial temperature rating, defined core voltage range, and compact 780‑FBGA package make it a practical choice for engineers building robust communications, networking, video, and storage interface solutions that require on‑device logic and memory resources.

Design teams can rely on the Arria II family handbook and device-level specifications to plan integration of serial interfaces, DSP resources and security features, while leveraging the device’s logic and memory to optimize system BOM and performance trade-offs.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for EP2AGX65DF29I5G.

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